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Illustration 20: Spatial OEM basic electrical connections
5.4
Recommended Footprint
The footprint for Spatial OEM incorporates four through-hole pads for the soldering of the four 2mm
stand-offs and 20 additional SMD pads for the board to board connector. The through-hole pads
are designed to allow solder paste to be applied before component placement so that the PCB can
be assembled using pick and place machines.
Illustration 21: Photo of Spatial OEM
footprint
Spatial OEM Reference Manual
Page 27 of 88
Version 2.7
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