HT66F20-1/HT66F30-1/HT68F20-1/HT68F30-1
Flash MCU with EEPROM
20-pin DIP (300mil) Outline Dimensions
)
*
+
,
-
.
/
Fig1. Full Lead Packages
See Fig1
Symbol
A
B
C
D
E
F
G
H
I
Symbol
A
B
C
D
E
F
G
H
I
Rev. 1.40
*
0
+
,
1
-
Dimensions in inch
Min.
Nom.
0.980
1.0�0
0.�40
0.�50
0.115
0.1�0
0.115
0.1�0
0.014
0.018
0.045
0.0�0
—
0.100 BSC
0.�00
0.�10
—
—
Dimensions in mm
Min.
Nom.
�4.89
��.1�
�.10
�.�5
�.9�
�.�0
�.9�
�.�0
0.��
0.4�
1.14
1.5�
—
�.54 BSC
7.��
7.87
—
—
�0�
)
0
1
.
/
Fig2. 1/2 Lead Packages
Max.
1.0�0
0.�80
0.195
0.150
0.0��
0.070
—
0.��5
0.4�0
Max.
��.9�
7.11
4.95
�.81
0.5�
1.78
—
8.��
10.9�
�ove��e� ��� �01�
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