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3. HARDWARE DESCRIPTION
4. ACCEPTANCE/PERIODIC
TESTS
5. FUNCTIONAL TESTS
(FACTORY SETTINGS)
GE Power Management
TABLE OF CONTENTS
3.1 CASE ASSEMBLY
3.1.1
CONSTRUCTION .............................................................................................. 3-1
3.1.2
ELECTRICAL CONNECTIONS AND WIRING .................................................. 3-3
3.1.3
IDENTIFICATION............................................................................................... 3-3
3.1.4
SYSTEM BLOCK DIAGRAM ............................................................................. 3-4
3.2 INSTALLATION
3.2.1
RECEIVING, HANDLING, AND STORAGE....................................................... 3-5
3.2.2
ENVIRONMENT................................................................................................. 3-5
3.2.3
MOUNTING........................................................................................................ 3-5
3.2.4
EXTERNAL CONNECTIONS............................................................................. 3-5
3.2.5
SURGE GROUND CONNECTIONS .................................................................. 3-5
3.3 PRINTED CIRCUIT BOARD MODULES
3.3.1
WARNING .......................................................................................................... 3-6
3.3.2
BASIC CONSTRUCTION .................................................................................. 3-6
3.3.3
MODULE IDENTIFICATION .............................................................................. 3-6
3.3.4
LOCAL USER INTERFACE (LUI) ...................................................................... 3-6
3.3.5
INPUT BOARD................................................................................................... 3-6
3.3.6
MAGNETICS MODULE ..................................................................................... 3-8
3.3.7
COMMUNICATIONS INTERFACE .................................................................... 3-9
3.3.8
DIGITAL OUTPUT / POWER SUPPLY BOARD .............................................. 3-10
3.3.9
DSP / ANI / COMM / LUI.................................................................................. 3-11
3.3.10
960 CPU BOARD ............................................................................................. 3-12
4.1 OVERVIEW
4.1.1
INTRODUCTION................................................................................................ 4-1
4.1.2
TEST EQUIPMENT............................................................................................ 4-1
4.1.3
DRAWINGS AND REFERENCES ..................................................................... 4-1
4.1.4
EQUIPMENT GROUNDING .............................................................................. 4-2
4.1.5
REQUIRED SETTINGS ..................................................................................... 4-2
4.1.6
GENERAL INSTRUCTIONS .............................................................................. 4-2
4.1.7
SETTING CHANGES ......................................................................................... 4-3
4.1.8
ENTERING TEST MODE................................................................................... 4-4
4.1.9
USING COMMUNICATIONS (OPTIONAL)........................................................ 4-4
4.2 GENERAL RELAY TESTS
4.2.1
T1 - RELAY STATUS AND DISPLAY TESTING............................................... 4-7
4.2.2
DISPLAY AND KEYPAD TESTS ....................................................................... 4-7
4.2.3
T2 - DIGITAL OUTPUT TEST ........................................................................... 4-8
4.2.4
T3 - CONFIGURABLE INPUT AND OUTPUT TEST ........................................ 4-9
4.2.5
T4 - AC SYSTEM INPUT TEST ...................................................................... 4-10
5.1 TEST SUMMARY
5.1.1
DESCRIPTION................................................................................................... 5-1
5.2 MEASURING UNIT TESTS
5.2.1
T1 - FAULT DETECTOR TEST......................................................................... 5-2
5.2.2
T2 - IT TRIP SUPERVISION TEST ................................................................... 5-2
5.2.3
T3 - IB BLOCKING SUPERVISION TEST ........................................................ 5-3
5.2.4
T4 - GROUND DIRECTIONAL TRIP TEST, IPT + NT ...................................... 5-3
5.2.5
T5 - GROUND DIRECTIONAL BLOCK TEST, IPB + NB.................................. 5-3
5.2.6
T6 - PHASE INSTANTANEOUS OVERCURRENT 50 ..................................... 5-4
5.2.7
T7 - GROUND INSTANTANEOUS OVERCURRENT 50G ............................... 5-4
5.2.8
T8 - GROUND TIME OVERCURRENT 51G ..................................................... 5-4
5.2.9
UNDERVOLTAGE TEST ................................................................................... 5-5
5.2.10
T9 - T10 - OVERVOLTAGE TEST ................................................................... 5-5
5.3 ZONE REACH AND TIMER TESTS
5.3.1
GENERAL ZONE REACH TESTING CONSIDERATIONS ............................... 5-8
5.3.2
T11 - ZONE 1 GROUND REACH, M1G GROUND FAULTS ............................ 5-8
5.3.3
T12 - ZONE 2 GROUND REACH, MTG GROUND FAULTS............................ 5-9
5.3.4
T13 - ZONE 3 GROUND REACH, M3G GROUND FAULTS ............................ 5-9
5.3.5
T14 - ZONE 4 GROUND REACH, M4G GROUND FAULTS........................... 5-10
ALPS Advanced Line Protection System
iii
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