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System Assumptions
Figure 5. Differential Microstrip Diagram
Table 3.
Stackup Details
Layer
L1
L2
L3
L4
Finished
Thickness
(mils)
November 2016
Document Number: 333580-002EN
OPCM Stack-Up Information
Cu Weight
Proposed
Thickness
(mils)
Soldermask
0.50
Top
Hoz+Plating
1.80
Prepreg
2.70
GND
1oz
1.20
Core
50
GND
1oz
1.20
Prepreg
2.70
Bottom
Hoz+Plating
1.80
Soldermask
0.50
62.40
Structure
Ref
Single End
50 Ohm ± 10%
Target
Finished
LW
LW
L2
3.94
1080
50mil
core
1080
L3
3.94
Intel® Quark™ Microcontroller D2000
Differential
90 Ohm ± 10%
Target
Finished
LW/SP
LW/SP
4.2/8
4.2/8
Platform Design Guide
13
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