Board Features - Xilinx SP701 User Manual

Board Features

The SP701 evaluation board features are listed here. Detailed information for each feature is
provided in Chapter 3: Board Component
• XC7S100-2FGGA676 package
• Form factor: 6.00 in (152.4 mm) square, 0.08844 in (88.44 mils) thick
• Configuration:
Quad SPI (QSPI) 1 Gb
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Direct QSPI flash program header
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USB-to-JTAG bridge
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• DDR3L SDRAM memory:
256Mx16 4 Gb DDR3-1866
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• 32 Kb I2C EEPROM for hardware ID storage accessible by FPGA and System Controller
• Clocks:
I2C programmable SYSCLK oscillator 33.33 MHz
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• VITA 57.1 FMC-LPC connector:
34 differential pairs or 68 single-ended LA[00-33] bus
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• 2x 10/100/1000 Tri-Speed Ethernet PHY
• Mobile industry processor interface (MIPI) features:
MIPI-CSI Camera Serial Interface (for PCAM 5C from Digilent)
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MIPI-DSI Display Serial Interface
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• HDMI output (1.4 specification support)
• USB-UART interface:
FT4232H JTAG/3xUART
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• System Controller (MSP430)
• I2C Bus
• 6x Pmod rt-angle receptacle (Digilent Pmod IF 1.2.0 specification support)
• General purpose I/O (GPIO):
8x LED (GPIO_LED[0:7]) (active-High)
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5x pushbutton switch, geographical, GPIO_SW_[N,E,S,W,C] (active-High)
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UG1319 (v1.0) July 12, 2019
SP701 Board User Guide
Descriptions.
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Chapter 1: Introduction
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