Board Specifications - Xilinx SP701 User Manual

1x pushbutton switch, CPU_RESET (active-High)
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2x 8-pole DIP switch, GPIO_DIP_SW_B[0:15] (active-High)
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• Operational Switches:
Power On-Off slide switch
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PROG_B pushbutton switch (active-Low)
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4-pole configuration mode DIP switch M[0:2]_0_SW, INIT_B_0 (active-Low)
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• Operational Status LEDs:
Done
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Power On
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PG (Power Good)
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• Power System:
V 0.90V or 1.00V (I2C selectable)
ccint
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I2C telemetry on 12V input and V
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Board Specifications

Dimensions
• Height: 6.00 in (152.4 mm)
• Width: 6.00 in (152.4 mm)
• Thickness: 0.08844 in (88.44 mils)
Note: A 3D model of this board is not available.
See the SP701 board website documentation tab
board schematics (0381874).
Environmental
• Temperature
Operating: 0°C to +45°C
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Storage: –25°C to +60°C
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• Humidity
10% to 90% non-condensing
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UG1319 (v1.0) July 12, 2019
SP701 Board User Guide
ccint
(Board Files check box) for the XDC listing and
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Chapter 1: Introduction
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