Board Features - Xilinx VCK190 Series User Manual

Board Features

The VCK190 evaluation board features are listed here. Detailed information for each feature is
provided in Chapter 3: Board Component
• XCVC1902, VSVA2197 package
• Form factor: extended height PCIe
• Onboard configuration from:
USB-to-JTAG bridge
○
JTAG pod 2 mm 2x7 flat cable connector
○
microSD card (PS MIO I/F)
○
microSD card (System Controller I/F)
○
• External boot module (EBM) configuration option
X-EBM-01 dual quad SPI (QSPI)
○
• Clocks
ACAP Bank 406 HDMI_REC_CLK_OUT 148.50 MHz
○
ACAP Bank 503 RTC Xtal 32.768 kHz
○
ACAP Bank 503 Si570 REF_CLK 33.3333 MHz
○
ACAP Bank 700 Si570 DDR4_CLK (DIMM) 200 MHz
○
ACAP Bank 705 Si570 DDR4_CLK2 (LPDDR4) 200 MHz
○
ACAP Bank 711 Si570 DDR4_CLK1 (LPDDR4) 200 MHz
○
ACAP Bank GTY103/4 (REFCLK0) PCIe_CLK0/1 100 MHz
○
ACAP Bank GTY105 (REFCLK0) Si570 zSFP_SI570_CLK 156.250 MHz
○
ACAP Bank GTY105 (REFCLK1) Si570 HSDP_SI570_CLK 156.250 MHz
○
ACAP Bank GTY200 (REFCLK0) 8A34001_CLK1_IN 100 MHz
○
IEEE-1588 eCPRI 8A34001 clocks (various)
○
• DDR4 8 GB 72-bit UDIMM
XPIO triplet 1 (banks 700, 701, 702)
○
• Two LPDDR4 interfaces (2x32-bit 4 GB components each)
XPIO triplets 2 (banks 703, 704, 705) and 4 (banks 709, 710, 711)
○
UG1366 (v1.0) January 7, 2021
VCK190 Board User Guide
Descriptions.
, double-slot (heatsink clearance)
®
Chapter 1: Introduction
www.xilinx.com
Send Feedback
9