Board Internal Thermal Monitoring; Placement Of The Temperature Sensors; Temperature Sensor Placement (Cp308 Top View) - Kontron CP308 User Manual

CP308
6. Thermal Considerations
The following chapters provide system integrators with the necessary information to satisfy
thermal and airflow requirements when implementing CP308 applications.
6.1

Board Internal Thermal Monitoring

To ensure optimal operation and long-term reliability of the CP308, all onboard components
must remain within the maximum temperature specifications. The most critical components on
the CP308 are the processor and the chipset. Operating the CP308 above the maximum oper-
ating limits will result in permanent damage to the board. To ensure functionality at the maxi-
mum temperature, the System Management Controller supports several temperature
monitoring and control features.
The CP308 includes several temperature sensors distributed over the complete board to mea-
sure the onboard temperature values and regulate the board's power consumption:
• Thermal sensors integrated in the processor
• Thermal sensors integrated in the chipset
• Onboard temperature sensor Temp1 (near the processor)
• Onboard temperature sensor Temp2 (below the DDR3 SODIMM memory module)
The onboard temperature sensors Temp1 and Temp2 are accessible via the System Manage-
ment Controller. For information on the temperature sensors integrated in the processor and
the chipset, refer to Chapter 6-2 and Chapter 6-3.
6.1.1

Placement of the Temperature Sensors

Figure 6-1: Temperature Sensor Placement (CP308 Top View)
Temp 2
ID 1027-4487, Rev. 3.0
DDR3 SODIMM Socket
Channel A
DDR3 SODIMM Socket
Channel B
Intel®
GS45
Thermal Considerations
Temp 1
Intel®
Core™2 Duo
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