Package characteristics
Figure 38. UFQFPN28 recommended footprint
4.30
1. Dimensions are in millimeters
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
90/98
0.30
0.55
Doc ID 023079 Rev 3
3.30
3.20
3.20
0.50
STM32F050xx
0.50
3.30
0.50
A0B0_ME_FP
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