Table 64. Ufqfpn28 - 4 X 4 Mm, 28-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package; Mechanical Data; Figure 37. Ufqfpn28 - 4 X 4 Mm, 28-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package Outline - STMicroelectronics STM32F050G6 Manual

STM32F050xx

Figure 37. UFQFPN28 - 4 x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package outline

A
Pin 1 ID
Detail Z
1. Drawing is not to scale.
2. Dimensions are in millimeters.
3. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
X
Table 64. UFQFPN28 – 4 x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package

mechanical data

Symbol
Min
A 0.5
A1 -0.05
D 3.9
D1 2.9
E 3.9
E1 2.9
L 0.3
L1 0.25
T
b 0.2
e
1. Values in inches are converted from mm and rounded to 4 decimal digits.
D
D1
e
T
millimeters
Typ
0.55
0
4
3
4
3
0.4
0.35
0.152
0.25
0.5
Doc ID 023079 Rev 3
Seating
B
Plane
Co 130x45°
Pin 1 corner
E1 E
L1
1
Detail Z
b
Max Min
0.6 0.0197
0.05 -0.002
4.1 0.1535
3.1 0.1142
4.1 0.1535
3.1 0.1142
0.5 0.0118
0.45 0.0098
0.3 0.0079
Package characteristics
L
28
Ro.125 Typ.
A1 A
Seating
Plane
A0B0_ME_V4
(1)
inches
Typ Max
0.0217 0.0236
0 0.002
0.1575 0.1614
0.1181 0.122
0.1575 0.1614
0.1181 0.122
0.0157 0.0197
0.0138 0.0177
0.006
0.0098 0.0118
0.0197
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