Table 63. Ufqfpn32 - 5 X 5 Mm, 32-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package; Mechanical Data; Figure 35. Ufqfpn32 - 5 X 5 Mm, 32-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package Outline - STMicroelectronics STM32F050G6 Manual

STM32F050xx

Figure 35. UFQFPN32 - 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package outline

1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in
Table 63. UFQFPN32 – 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package

mechanical data

Dim.
Min
A 0.5
A1 0.00
A3
b 0.18
D 4.90
D2
E 4.90
E2 3.40
e
L 0.30
ddd
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Seating plane
C
A3
e
9
8
b
E2
1
32
Pin # 1 ID
R = 0.30
Bottom view
Table 8: Pin
millimeters
Typ
0.55
0.02
0.152
0.23
5.00
3.50
5.00
3.50
0.500
0.40
0.08
Doc ID 023079 Rev 3
A1
D
16
17
E
24
L
D2
L
definitions.
Max Min
0.6 0.0197
0.05 0
0.28 0.0071
5.10 0.1929
5.10 0.1929
3.60 0.1339
0.50 0.0118
Package characteristics
ddd C
A
A0B8_ME
(1)
inches
Typ
0.0217
0.0008
0.006
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
Max
0.0236
0.0020
0.0110
0.2008
0.2008
0.1417
0.0197
87/98