Power Supply Module Faults; Thermal Control - Intel SSR212CC User Manual

Power Supply Module Faults

Symptom
1. Front Panel FAULT
LED amber

Thermal Control

The Intel® Storage System SSR212CC enclosure uses extensive thermal monitoring and
takes a number of actions to ensure component temperatures are kept low and also to
minimize acoustic noise. Airflow is from front to rear of the enclosure.
Symptom
If the ambient air is cool
(below 25 °C) and the fans
are observed to increase in
speed then some restriction
on airflow may be causing
additional internal
temperature rise.
NOTE: This is not a fault
condition.
Intel® Storage System SSR212CC User Guide
Cause
1. Any power 1. Check that he AC mains connection to power
fault supply/unit is live.
Cause
The first stage in the thermal
control process is for the fans
to automatically increase in
speed when a thermal
threshold is reached. This
may be caused by higher
ambient temperatures in the
local environment and may
be perfectly normal.
NOTE: This threshold
changes according
to the number of
drives and power
supplies fitted.
Troubleshooting and Problem Solving
Action
Action
1. Check the installation for any airflow
restrictions at either the front or rear
of the enclosure. A minimum gap of
25 mm at the front and 50 mm at the
rear is recommended.
2. Check for restrictions due to dust
build-up; clean as appropriate.
3. Check for excessive re-circulation of
heated air from rear to the front, use
in a fully enclosed rack installation is
not recommended.
4. Check that all blank modules are in
place.
5. Reduce the ambient temperature.
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