Mechanical Specifications; Package; Materials Information - Intel CELERON 1.10 GHZ Datasheet

5.0

Mechanical Specifications

There are three package technologies which Celeron processors use. They are the S.E.P. Package,
the PPGA package, and the FC-PGA/FC-PGA2 packages. The S.E.P. Package and FC-PGA/
FC-PGA2 packages contain the processor core and passive components, while the PPGA package
does not have passive components.
The processor edge connector defined in this document is referred to as the "SC242 connector."
See the SC242 Design Guidelines (Order Number 243397) for further details on the edge
connector.
The processor socket connector is defined in this document is referred to as the "370-pin socket."
See the 370-Pin Socket (PGA370) Design Guidelines (Order Number 244410) for further details on
the socket.
5.1 S.E.P. Package
This section defines the mechanical specifications and signal definitions for the Celeron processor
in the S.E.P. Package.
5.1.1

Materials Information

The Celeron processor requires a retention mechanism. This retention mechanism may require
motherboard holes to be 0.159" diameter if low cost plastic fasteners are used to secure the
retention mechanisms. The larger diameter holes are necessary to provide a robust structural design
that can shock and vibe testing. If captive nuts are used in place of the plastic fasteners, then either
the 0.159" or the 0.140" diameter holes will suffice as long as the attach mount is used.
Figure 19
Figure 20
around the tooling holes and the top and side edges of the substrate.
Datasheet
with substrate dimensions is provided to aid in the design of a heatsink and clip. In
all area on the secondary side of the substrate is zoned "keepout", except for 25 mils
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Intel Celeron Processor up to 1.10 GHz
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