Processor Power For The Ppga And Fc-Pga Packages - Intel CELERON 1.10 GHZ Datasheet

® ®
Intel Celeron Processor up to 1.10 GHz
Table 40. Processor Power for the PPGA and FC-PGA Packages
Processor
Core
Frequency
333 MHz
366 MHz
400 MHz
433 MHz
466 MHz
500 MHz
533 MHz
3
533A MHz
3
566 MHz
3
600 MHz
633 MHz
667 MHz
700 MHz
733 MHz
766 MHz
800 MHz
850 MHz
900 MHz
950 MHz
1 GHz
1.10 GHz
NOTES:
1. These values are specified at nominal V
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum T
3. FC-PGA package only.
4. The Thermal Design Power (TDP) Celeron
values are based on device characterization and do not reflect any silicon design changes to lower processor
power consumption. The TDP values represent the thermal design point required to cool Celeron
processors in the platform environment while executing thermal validation type software.
5. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the
die area over which the power is generated. Power for these processors is generated from the core area
shown in
6. T
junctionoffset
hottest location on the processor's core. T
measurement error. Diode kit measurement error must be added to the T
Intel has characterized the use of the Analog Devices AD1021 diode measurement kit and found its
measurement error to be ±1
7. For processors with a CPUID of 0683h, the TDP number is 11.2 W.
8. For processors with a CPUID of 0683h, the TDP number is 11.9 W.
9. For processors with a CPUID of 0683h, the TDP number is 12.6 W.
10.The Tj min for processors with a CPUID of 068x is 0
66
Processor Processor
Thermal Thermal
L2
Design Design
Cache
2,3
Power Power
Size
(W) up to (W) for
(KB)
CPUID CPUID
0686h 068Ah
128 19.7 NA
128 21.7 NA
128 23.7 NA
128 24.1 NA
128 25.6 NA
128 27.0 NA
128 28.3 NA
4,7
128 14.0 NA
4,8
128 14.9 19.2
4,9
128 15.8 19.6
4
128 16.5 20.2
4
128 17.5 21.1
4
128 18.3 21.9
4
128 19.1 22.8
4
128 20.0 23.6
4
128 20.8 24.5
4
128 22.5 25.7
128 NA 26.7
128 NA 28.0
128 NA 29.0
128 NA 33.0
specification.
JUNCTION
Figure 17.
is the worst-case difference between the thermal reading from the on-die thermal diode and the
.
o
C
Power Power
5 5
Density Density
2 2
(W/cm ) (W/cm )
2,3
For For
CPUID CPUID
0686h 068Ah
NA NA
NA NA
NA NA
NA NA
NA NA
NA NA
NA NA
4
17.5 NA
4 4
18.5 30
4 4 4
19.7 30.5
4 4 4
25.8 31.5
4 4 4
27.3 32.9
4 4 4
28.6 34.1
4 4 4
29.8 35.5
4 4 4
31.3 36.8
4 4 4
32.6 38.2
4 4 4
35.2 40.0
4 4
NA 41.6
4
NA 43.6
4
NA 45.2
4
NA 51.4
for the processor core.
CC CORE
®
processors in production has been redefined. The updated TDP
values do not include any thermal diode kit
junctionoffset
o o
C with a 3 C– 5
10
Min Max Max
T T T
CASE CASE
JUNCTION
(°C) (°C) (°C)
5 85 NA
5 85 NA
5 85 NA
5 85 NA
5 70 NA
5 70 NA
5 70 NA
NA NA 90
NA NA 90
NA NA 90
NA NA 82
NA NA 82
NA NA 80
NA NA 80
NA NA 80
NA NA 80
NA NA 80
NA NA 77
NA NA 79
NA NA 75
NA NA 77
®
value from the table.
junctionoffset
o
C margin error.
Datasheet
T
JUNCTION
6
Offset
(°C)
NA
NA
NA
NA
NA
NA
NA
2.6
2.6
2.6
2.6
2.6
2.7
2.8
3.0
3.0
3.3
3.6
3.8
3.8
4.4