Intel CELERON 1.10 GHZ Datasheet page 4

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Intel Celeron Processor up to 1.10 GHz
3.4.5
3.4.6
3.5 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 64
4.0 Thermal Specifications and Design Considerations......................................................... 65
4.1 Thermal Specifications........................................................................................ 65
4.1.1
5.0 Mechanical Specifications................................................................................................ 69
5.1 S.E.P. Package ................................................................................................... 69
5.1.1
5.1.2
5.2 PPGA Package ................................................................................................... 79
5.2.1
5.2.2
5.3 FC-PGA/FC-PGA2 Packages ............................................................................. 92
5.3.1
5.3.2
5.3.3
5.4 Processor Markings (PPGA/FC-PGA/FC-PGA2 Packages) ............................. 108
5.5 Heatsink Volumetric Keepout Zone Guidelines................................................. 109
6.0 Boxed Processor Specifications..................................................................................... 110
6.1 Mechanical Specifications for the Boxed Intel
6.1.1
6.1.2
6.1.3
6.2 Thermal Specifications...................................................................................... 115
6.2.1
6.3 Electrical Requirements for the Boxed Intel
6.3.1
7.0 Processor Signal Description ......................................................................................... 120
7.1 Signal Summaries ............................................................................................. 126
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Reading Overshoot/Undershoot Specification Tables
(FC-PGA/FC-PGA2 Packages) .............................................................. 61
Determining if a System meets the Overshoot/Undershoot
Specifications (FC-PGA/FC-PGA2 Packages)....................................... 62
Thermal Diode........................................................................................ 68
Materials Information.............................................................................. 69
Signal Listing (S.E.P. Package) ............................................................ 70
PPGA Package Materials Information.................................................... 79
PPGA Package Signal Listing ................................................................ 81
FC-PGA Mechanical Specifications ....................................................... 92
Mechanical Specifications (FC-PGA2 Package) .................................... 94
5.3.2.1 Recommended Mechanical Keep-Out Zones
(FC-PGA2 Package) ................................................................. 96
FC-PGA/FC-PGA2 Package Signal List................................................. 97
Mechanical Specifications for the S.E.P. Package............................... 110
6.1.1.1 Boxed Processor Heatsink Weight.......................................... 112
6.1.1.2 Boxed Processor Retention Mechanism ................................. 112
Mechanical Specifications for the PPGA Package............................... 113
6.1.2.1 Boxed Processor Heatsink Weight.......................................... 114
Mechanical Specifications for the FC-PGA/FC-PGA2 Packages......... 114
6.1.3.1 Boxed Processor Heatsink Weight.......................................... 115
Thermal Requirements for the Boxed Intel
6.2.1.1 Boxed Processor Cooling Requirements ................................ 115
6.2.1.2 Boxed Processor Thermal Cooling Solution Clip .................... 117
Electrical Requirements ....................................................................... 117
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Celeron Processor ................ 110
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Celeron Processor........ 115
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Celeron Processor ................... 117
Datasheet