Thermal Diode; Thermal Diode Parameters (S.e.p. And Ppga Packages); Thermal Diode Parameters (Fc-Pga/Fc-Pga2 Packages); Thermal Diode Interface - Intel CELERON 1.10 GHZ Datasheet

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Intel Celeron Processor up to 1.10 GHz
4.1.1

Thermal Diode

The Celeron processor incorporates an on-die diode that can be used to monitor the die
temperature. A thermal sensor located on the motherboard or a standalone measurement kit may
monitor the die temperature of the Intel Celeron processor for thermal management purposes.
Table 42
Note: The reading of the thermal sensor connected to the thermal diode will not necessarily reflect the
temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor, on-
die temperature gradients between the location of the thermal diode and the hottest location on the
die at a given point in time, and time based variations in the die temperature measurement. Time
based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is
slower than the rate at which the T
Table 42. Thermal Diode Parameters (S.E.P. and PPGA Packages)
Symbol
I
forward bias
n_ideality
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. At room temperature with a forward bias of 630 mV.
3. n_ideality is the diode ideality factor parameter, as represented by the diode equation:
I-Io(e (Vd*q)/(nkT) – 1).
4. Not 100% tested. Specified by design characterization.
Table 43. Thermal Diode Parameters (FC-PGA/FC-PGA2 Packages)
Symbol
I
forward bias
n_ideality
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 100
3. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
I =Is(e^ ((Vd*q)/(nkT)) – 1), where Is = saturation current, q = electronic charge, Vd = voltage across the
fw
diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).
4. Not 100% tested. Specified by design characterization.
Table 44. Thermal Diode Interface
Pin Name
THERMDP
THERMDN
68
to Table 44 provide the diode parameter and interface specifications.
junction
Min Typ
5
1.0000 1.0065
Min Typ
5
1.0057 1.0080
C with a forward bias current of 5–300 A.
SC242 Connector
Signal #
temperature can change.
Max Unit Notes
500 uA 1
1.0173 2,3
Max Unit Notes
300 uA 1
1.0125 2, 3
370-Pin Socket Pin #
B14 AL31
B15 AL29
Pin Description
diode anode (p junction)
diode cathode (n junction)
Datasheet