Smbus; I 2 C Bus; Spi Bus (Bios); Table 40 Sw14 - Bios Boot Device Selection - Congatec conga-TEVAL3/COMe 3.1 User Manual

4.11

SMBus

The SMBus signals are available on the feature connector X56 described in section 4.22 "Feature Connector". The SMBus on the module is
powered by the standby power rail. To avoid current leakage, the conga-TEVAL3/COMe 3.1 features a FET switch that isolates the SMB devices
that are powered by the main power rail.
4.12 I C Bus
2
The I²C signals are available in different locations on the conga-TEVAL3/COMe 3.1, including on the feature connector X56 described in section
4.22. The conga-TEVAL3/COMe 3.1 includes socket U50 for attaching an I²C EEPROM for test purposes during the system development.
The 8-pin DIL socket supports various 2-wire 3.3 V serial EEPROMS such as 24C04, 24C08 and 24C16. Use the I²C control commands implemented
in the congatec CGOS API driver to access the EEPROMs. For more information, refer to the CGOS manual and the user's guide of the COM
Express module.
Connector Type
U50: EEPROM in 8-pin DIL package
4.13

SPI Bus (BIOS)

The conga-TEVAL3/COMe 3.1 provides an 16-pin SOIC16 socket (U48) for a BIOS SPI flash. Use DIP SW14 to select the flash device to boot
from.
Table 40 SW14 - BIOS Boot Device Selection
SW1 SW2
OFF OFF
OFF ON
ON OFF
ON ON
Connector Type
U48: SPI flash in 16-pin 300 mil SOIC16 package
Copyright © 2025 congatec GmbH
Configuration
Boot from on-module SPI Flash (default)
Boot from carrier board SPI Flash
Not supported
Boot from on-module SPI Flash, but load management data from carrier SPI
TEVA31_m001
U50
U48 SW14
47/62