Congatec conga-TEVAL3/COMe 3.1 User Manual page 12

1 Introduction
1.1 COM Express
COM Express is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
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transition from legacy interfaces to the newest technologies available today.
A Computer On Module integrates all the core components and standard I/O interfaces of a common PC onto an application specific carrier
board. The key advantage of the COM in the embedded computer industries is that all the highly integrated, high speed components such as
CPU, chipsets and memory are combined on a small module form factor for easy adaptation into different applications across multiple market
segments.
COM Express modules have standardized form factors and specified pinouts on the two system connectors that remain the same regardless
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of the vendor. The COM Express
include, but are not limited to, PCI Express, PCI, Graphics, High Definition Audio, parallel ATA, serial ATA, Gigabit Ethernet and USB ports.
Two ruggedized, shielded connectors provide the carrier board interface and carry all the I/O signals to and from the COM Express
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 conga-TEVAL3/COMe 3.1
The conga-TEVAL3/COMe 3.1 carrier board is designed based on the Type 6 pinout definition and it complies with COM Express
3.1. The conga-TEVAL3/COMe 3.1 provides most of the functional requirements for any embedded PC application. These functions include,
but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB, DisplayPort
and Gigabit Ethernet. To ensure stable data throughput, the carrier board is equipped with two high performance connectors in accordance
with the COM Express
By combining the scalability of COM Express
with a platform to jump-start the development of systems and applications based on COM Express
design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market.
The various features and capabilities offered by the conga-TEVAL3/COMe 3.1 make it ideal for the integration of Compact and Basic form
factor CPU modules.
Copyright © 2025 congatec GmbH
Concept
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® module reflects the functional requirements for a wide range of embedded applications. These functions
specification.
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modules, the conga-TEVAL3/COMe 3.1 carrier board provides manufacturers and developers
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TEVA31_m001
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specification. This helps to reduce product
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