Table of Contents
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4.8.4.
Audio Interfaces Design Considerations ...................................................................... 54
4.9.
ADC Interfaces ..................................................................................................................... 55
4.10.
Video Output Interfaces ........................................................................................................ 55
4.10.1.
4.10.2.
4.10.3.
4.11.
Camera Interface .................................................................................................................. 63
4.11.1. MIPI Design Considerations ........................................................................................ 67
4.12.
Touch Panel Interface ........................................................................................................... 69
4.13.
PCIe Interfaces ..................................................................................................................... 69
4.14.
RGMII Interfaces .................................................................................................................. 74
4.15.
GPIO ..................................................................................................................................... 80
5
RF Specifications ............................................................................................................................ 83
5.1.
Wi-Fi & Bluetooth .................................................................................................................. 83
5.1.1.
Wi-Fi Overview ............................................................................................................ 83
5.1.2.
Bluetooth Overview ...................................................................................................... 86
5.1.3.
Reference Design ........................................................................................................ 87
5.2.
RF Routing Guidelines .......................................................................................................... 87
5.3.
Requirements for Antenna Design ........................................................................................ 89
5.4.
RF Connector Recommendation .......................................................................................... 90
6
Electrical Characteristics and Reliability ...................................................................................... 92
6.1.
Absolute Maximum Ratings .................................................................................................. 92
6.2.
Power Supply Ratings .......................................................................................................... 92
6.3.
Power Consumption ............................................................................................................. 93
6.4.
Digital I/O Characteristics ..................................................................................................... 94
6.5.
ESD Protection ..................................................................................................................... 96
6.6.
Operating and Storage Temperatures ................................................................................... 97
7
Mechanical Information .................................................................................................................. 98
7.1.
Mechanical Dimensions ........................................................................................................ 98
7.2.
Recommended Footprint .................................................................................................... 100
7.3.
Top and Bottom Views ........................................................................................................ 101
8
Storage, Manufacturing & Packaging .......................................................................................... 102
8.1.
Storage Conditions ............................................................................................................. 102
8.2.
Manufacturing and Soldering .............................................................................................. 103
8.3.
Packaging Specification ...................................................................................................... 105
8.3.1.
Carrier Tape ............................................................................................................... 105
8.3.2.
Plastic Reel ................................................................................................................ 106
8.3.3.
Mounting Direction ..................................................................................................... 106
8.3.4.
Packaging Process .................................................................................................... 107
9
Appendix References ................................................................................................................... 108
SG368Z_Series_Hardware_Design
eDP Interface ........................................................................................................ 56
HDMI Interface ..................................................................................................... 58
LCM Interfaces ..................................................................................................... 61
Smart Module Series
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