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Quectel SC262R Series Hardware Design

Quectel SC262R Series Hardware Design

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SC262R Series
Hardware Design
Smart Module Series
Version: 1.0.0
Date: 2022-07-11
Status: Preliminary
SC262R_Series_Hardware_Design
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  • Page 1 SC262R Series Hardware Design Smart Module Series Version: 1.0.0 Date: 2022-07-11 Status: Preliminary SC262R_Series_Hardware_Design 0 / 115...
  • Page 2 Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Smart Module Series About the Document Revision History Version Date Author Description Today JIN/ 2022-07-11 Creation of the document Xiaomeng GUO Today JIN/ 1.0.0 2022-07-11 Preliminary Xiaomeng GUO SC262R_Series_Hardware_Design 4 / 115...

  • Page 6: Table Of Contents

    Smart Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................12 Product Overview ..........................13 2.1. Frequency Bands and Functions ..................... 13 2.2. Key Features ........................... 15 2.3.
  • Page 7 Smart Module Series 3.22.1. Reference Circuit Design for Microphone Interfaces ............. 67 3.22.2. Reference Circuit Design for Earpiece Interface ............68 3.22.3. Reference Circuit Design for Headset Interface ............68 3.22.4. Reference Circuit Design for Loudspeaker Interface............. 69 3.22.5. Design Considerations for Audio Interfaces ..............69 3.23.
  • Page 8 Smart Module Series 9.3. Packaging Specification ......................105 9.3.1. Carrier Tape ........................106 9.3.2. Plastic Reel ........................106 9.3.3. Packaging Process ...................... 107 10 Appendix References ........................108 SC262R_Series_Hardware_Design 7 / 115...
  • Page 9 Smart Module Series Table Index Table 1: SC262R-EM Frequency Bands ....................13 Table 2: SC262R-NA Frequency Bands..................... 14 Table 3: SC262R-WF Frequency Bands ....................14 Table 4: Key Features ..........................15 Table 5: I/O Parameters Definition ......................22 Table 6: Pin Description ..........................22 Table 7: Power Description ........................
  • Page 10 Smart Module Series Table 42: SC262R-EM Power Consumption ....................89 Table 43: SC262R-NA Power Consumption ....................93 Table 44: SC262R-EM RF Output Power ....................94 Table 45: SC262R-NA RF Output Power ....................95 Table 46: SC262R-EM RF Receiving Sensitivity ..................96 Table 47: SC262R-NA RF Receiving Sensitivity ..................
  • Page 11 Smart Module Series Figure Index Figure 1: Functional Diagram ........................19 Figure 2: Pin Assignment (Top View) ......................21 Figure 3: Power Supply Limits during Burst Transmission ................ 36 Figure 4: Star Structure of the Power Supply .................... 37 Figure 5: Reference Circuit of Power Supply ..................... 37 Figure 6: Turn On the Module Using Driving Circuit ..................
  • Page 12 Smart Module Series Figure 42: Bottom Dimension (Bottom View) ................... 100 Figure 43: Recommended Footprint (Top View) ..................101 Figure 44: Top and Bottom Views of the Module ..................102 Figure 45: Recommended Reflow Soldering Thermal Profile ..............104 Figure 46: Carrier Tape Dimension Drawing .................... 106 Figure 47: Plastic Reel Dimension Drawing ....................

  • Page 13: Introduction

    Smart Module Series Introduction This document defines SC262R series module and describes its air interface and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 14: Product Overview

    Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. SC262R series module is available in three variants: SC262R-EM, SC262R-NA, SC262R-WF. The following tables show the supported frequency bands and network standards of SC262R series modules. Table 1: SC262R-EM Frequency Bands...
  • Page 15 Smart Module Series Galileo: 1575.42 ± 1.023 MHz Table 2: SC262R-NA Frequency Bands Mode Frequency LTE-FDD B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 LTE-TDD WCDMA B2/B4/B5 2402–2482 MHz Wi-Fi 802.11a/b/g/n/ac 5180–5825 MHz Bluetooth 4.2 LE 2402–2480 MHz GPS: 1575.42 ± 1.023 MHz GLONASS: 1597.5–1605.8 MHz GNSS BDS: 1561.098 ±...

  • Page 16: Key Features

    Smart Module Series 2.2. Key Features The following table describes the detailed features of SC262R series module. Table 4: Key Features Feature Details ⚫ 64-bit quad-core ARM Cortex-A53 microprocessor, up to 1.3 GHz Application Processor ⚫ 512 KB L2 cache ⚫...
  • Page 17 Smart Module Series R99: ⚫ CSD: 9.6 kbps, 14.4 kbps GPRS: ⚫ Supports GPRS multi-slot class 33 (33 by default) ⚫ Coding scheme: CS 1–4 ⚫ Max. 107 kbps (DL)/Max. 85.6 kbps (UL) GSM Features EDGE: ⚫ Supports EDGE multi-slot class 33 (33 by default) ⚫...
  • Page 18 Smart Module Series ⚫ Compliant with USB 2.0 specification ⚫ Supports up to 480 Mbps ⚫ USB Interface Supports USB OTG ⚫ Used for AT command communication, data transmission, software debugging and firmware upgrade Three UART interfaces: UART5, UART2 (debug UART) and UART1, baud rate up to 4 Mbps ⚫...

  • Page 19: Functional Diagram

    Smart Module Series 2.3. Functional Diagram The following figure shows a block diagram of SC262R series module and illustrates the major functional parts. ⚫ Power management ⚫ Radio frequency ⚫ Baseband ⚫ LPDDR3 + eMMC flash ⚫ Peripheral interfaces -- USB interface...

  • Page 20: Evb Kit

    VOL_DOWN Figure 1: Functional Diagram 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (Smart EVB-G2) with accessories to control or test the module. For more details, see document [1]. SC262R_Series_Hardware_Design 19 / 115...

  • Page 21: Application Interfaces

    Smart Module Series Application Interfaces 3.1. General Description SC262R is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following chapters provide the detailed description of pins/interfaces listed below. ⚫ Power supply ⚫ VRTC interface ⚫...

  • Page 22: Pin Assignment

    Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of SC262R series module. GPIO_42 VBAT_BB VBAT_BB GPIO_44 GPIO_63 MIC1_P GPIO_43 MIC_GND GPIO_66 MIC2_P GPIO_87 GPIO_94 GPIO_95 EAR_P GPIO_13 EAR_N GPIO_12 SPK_P GPIO_59 SPK_N GPIO_48 GPIO_45 USB_DM...

  • Page 23: Pin Description

    Smart Module Series 3.3. Pin Description Table 5: I/O Parameters Definition Type Description Analog input Analog output Analog input/output Digital input Digital output Digital input/output Open drain Power input Power output Power input/output The following table shows the pin definition and electrical characteristics of the module. Table 6: Pin Description Power Supply Pin Name...
  • Page 24 Smart Module Series Power supply for external GPIO’s Vnom = 1.8 V LDO5_1V8 1.8 V output max = 20 mA pull-up and level shift circuits. Power supply for sensors, cameras, and I2C pull-up circuit. If it is used, connect Vnom = 1.8 V LDO6_1V8 1.8 V output an external...
  • Page 25 Smart Module Series Pin Name Pin No. 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 149, 162, 171, 172, 176, 187–191, 202–204, 206–224, 226–231, 233–238, 240, 241, 243–245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271–274 Audio Interfaces Pin Name...
  • Page 26 Smart Module Series Pin Name Pin No. Description DC Characteristics Comment Charging power input. Vmax = 6.2 V 141, USB 5 V power USB_VBUS Vmin = 4.35 V input. Vnom = 5.0 V USB/adaptor insertion detection. USB 2.0 USB 2.0 standard USB_DM differential data (-) compliant.
  • Page 27 Smart Module Series max = 55 mA Either 1.8 V or For 1.8 V (U)SIM: 2.95 V (U)SIM card Vmax = 1.85 V (U)SIM2 card is supported and USIM2_VDD Vmin = 1.75 V power supply can be identified automatically by the For 2.95 V (U)SIM: module.
  • Page 28 Smart Module Series max = 0.45 V UART5_TXD UART5 transmit min = 1.35 V max = 0.63 V UART5_RXD UART5 receive min = 1.17 V max = 0.63 V UART5_CTS DCE clear to send min = 1.17 V DCE request to max = 0.45 V UART5_RTS send...
  • Page 29 Smart Module Series 2.95 V SD card: max = 0.73 V SD_DATA3 SDIO data bit 3 min = 1.84 V max = 0.37 V min = 2.2 V SD card hot-plug max = 0.63 V SD_DET Active low. detect min = 1.17 V Touch Panel Interface Pin Name Pin No.
  • Page 30 Smart Module Series LCD MIPI data 2 DSI_LN2_P LCD MIPI data 3 DSI_LN3_N LCD MIPI data 3 DSI_LN3_P Camera Interfaces Pin Name Pin No. Description DC Characteristics Comment MIPI CSI1 clock CSI1_CLK_N MIPI CSI1 clock CSI1_CLK_P MIPI CSI1 lane 0 CSI1_LN0_N data (-) MIPI CSI1 lane 0...
  • Page 31 Smart Module Series MIPI CSI0 lane 2 CSI0_LN2_N data (-) MIPI CSI0 lane 2 CSI0_LN2_P data (+) MIPI CSI0 lane 3 CSI0_LN3_N data (-) MIPI CSI0 lane 3 CSI0_LN3_P data (+) Master clock of CAM0_MCLK camera0 Master clock of CAM1_MCLK camera1 CAM0_RST Reset of camera0...
  • Page 32 Smart Module Series Disabled by default Reset the and can be enabled RESET_N module via software configuration. If it is not used, keep it open. max = 0.63 V Cannot be VOL_UP Volume up min = 1.17 V externally pulled up. 1.8 V power domain.
  • Page 33 Smart Module Series Internally pulled down with a 100 kΩ Battery type BAT_ID = 0.1–1.7 V resistor. detect If it is not used, keep it open. If you use an internal charging chip, keep this pin open. CHG_SEL Charging select If you use an external charging chip, connect it to...
  • Page 34 Smart Module Series General-purpose GPIO_48 input/output General-purpose GPIO_59 input/output General-purpose GPIO_12 input/output General-purpose GPIO_13 input/output General-purpose GPIO_95 input/output General-purpose GPIO_94 input/output General-purpose GPIO_87 input/output General-purpose GPIO_66 input/output General-purpose GPIO_43 input/output General-purpose GPIO_63 input/output General-purpose GPIO_44 input/output General-purpose GPIO_42 input/output General-purpose GPIO_93 input/output General-purpose...
  • Page 35 Smart Module Series General-purpose GPIO_6 input/output General-purpose GPIO_7 input/output General-purpose GPIO_127 input/output General-purpose GPIO_34 input/output General-purpose GPIO_90 input/output General-purpose GPIO_39 input/output General-purpose GPIO_86 input/output Cannot be pulled up General-purpose during power-on. GPIO_88 input/output 1.8 V power domain. General-purpose GPIO_85 input/output 1.8 V power domain.
  • Page 36 Smart Module Series You can force the module to enter Force the module emergency USB_BOOT into emergency download mode by download mode pulling this pin up to LDO5_1V8 during power-on. Vibration Motor Driver Interface Pin Name Pin No. Description DC Characteristics Comment Vibration motor Connect it to the...

  • Page 37: Power Supply

    3.4. Power Supply 3.4.1. Power Supply Pins SC262R series module provides two VBAT_RF pins and two VBAT_BB pins for connection with the external power supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for the baseband part of the module.

  • Page 38: Reference Design For Power Supply

    The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of SC262R series module should be able to provide sufficient current of at least 3 A. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module.

  • Page 39: Turn On And Off

    Smart Module Series The module supports battery charging by default. If the above power supply design is adopted, make sure the charging function is disabled by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip. 3.5.

  • Page 40: Turn Off The Module

    Smart Module Series The turning-on scenario is illustrated in the following figure. Note2 VBAT(Typ. 3.8 V) PWRKEY > 1.6 s 47 ms LDO5_1V8 Software controlled Software controlled LDO6_1V8 LDO17_2V85 38 s Others Active Figure 8: Timing of Turning On the Module NOTE 1.

  • Page 41: Vrtc Interface

    VRTC is 2.0–3.25 V and the recommended typical value is 3.0 V. 3.7. Power Output SC262R series module supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise.

  • Page 42: Battery Charging And Management

    USIM2_VDD 1.8/2.95 3.8. Battery Charging and Management SC262R series module supports battery charging. The battery charger IC in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. ⚫...
  • Page 43 If you use an external charging chip, connect it to GND. SC262R series module supports battery temperature detection in the condition that the battery integrates a thermistor (47 kΩ 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin.

  • Page 44: Usb Interface

    3.9. USB Interface SC262R series module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command communication, data transmission, software debugging and firmware upgrade.
  • Page 45 Smart Module Series VUSB USB_VBUS USB_DM USB_DM USB_DP USB_DP USB_ID Module 100 nF ESD ESD ESD Figure 12: USB Interface Reference Design (OTG Not Supported) VBAT VOUT 1.0 μH VOUT 10 μF 22 μF/ 10 V VBAT GPIO VUSB USB_VBUS USB_DM USB_DM USB_DP...

  • Page 46: Uart Interfaces

    -0.10 USB_DP 32.15 3.10. UART Interfaces SC262R series module provides three UART interfaces and supports up to 4 Mbps: ⚫ UART5: 4-wire UART interface, and hardware flow control is supported ⚫ UART2 (debug UART): 2-wire UART interface, used for debugging by default ⚫...
  • Page 47 Smart Module Series design. LDO5_1V8 VDD_3.3V VCCA VCCB 100 pF 100 pF CTS_3.3V UART5_CTS UART5_RTS RTS_3.3V UART5_TXD TXD_3.3V UART5_RXD RXD_3.3V Figure 14: Reference Circuit with Voltage Level Translator Chip (for UART5) The following figure is an example of connection between the module and PC. It is recommended to add a level translator and an RS-232 level translator chip between the module and PC.

  • Page 48: U)Sim Interfaces

    Smart Module Series 3.11. (U)SIM Interfaces SC262R series module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the (U)SIM card is powered by the internal power supply of the module.
  • Page 49 Smart Module Series SC262R series module supports (U)SIM card hot-plug via the USIM_DET pin. (This function is disabled by default via software. To enable it, contact Quectel Technical Supports to change the software configuration.) A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below.

  • Page 50: Sd Card Interface

    6-pin (U)SIM Card Connector close to the module. 3.12. SD Card Interface SD Card interface of SC262R series module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 13: Pin Definition of SD Card Interface Pin Name Pin No.
  • Page 51 Smart Module Series SD_LDO11 SD_LDO12 LDO 5_1V8 120K NM_51K NM_51K NM_10K NM_51K NM_51K SD_DATA2 P1-DAT2 SD_DATA3 P2-CD/DAT3 SD_CMD P3-CMD P4-VDD SD_CLK P5-CLK P6-VSS SD_DATA0 P7-DAT0 SD_DATA1 P8-DAT1 SD_DET DETECTIVE Module 4.7 μF 33 pF SD Card Connector Figure 18: Reference Circuit for SD Card Interface SD_LDO11 is the power supply for the SD card and can provide up to 800 mA output current.

  • Page 52: Gpio Interfaces

    Smart Module Series SD_DATA3 21.35 3.13. GPIO Interfaces SC262R series module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 15: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO No.
  • Page 53 Smart Module Series GPIO_45 GPIO_45 B-PD:nppukp Wakeup GPIO_46 GPIO_46 B-PD:nppukp Wakeup GPIO_47 GPIO_47 B-PD:nppukp GPIO_48 GPIO_48 B-PD:nppukp Wakeup GPIO_59 GPIO_59 B-PD:nppukp Wakeup GPIO_61 GPIO_61 B-PD:nppukp Wakeup GPIO_62 GPIO_62 B-PD:nppukp Wakeup GPIO_63 GPIO_63 B-PD:nppukp Wakeup GPIO_66 GPIO_66 B-PD:nppukp GPIO_85 GPIO_85 B-PD:nppukp GPIO_86 GPIO_86 B-PD:nppukp...

  • Page 54: I2C Interfaces

    B-PD:nppukp UART1_TXD GPIO_0 B-PD:nppukp UART1_RXD GPIO_1 B-PD:nppukp Wakeup NOTE For more details about GPIO configuration, see document [2]. 3.14. I2C Interfaces SC262R series module provides four I2C interfaces. All I2C interfaces are open drain signals and SC262R_Series_Hardware_Design 53 / 115...

  • Page 55: Spi Interfaces

    I2C data for external sensor 3.15. SPI Interfaces SC262R series module provides three SPI interfaces, which are multiplexed from UART and GPIO interfaces. These interfaces can only support master mode and can be used for fingerprint recognition. Table 17: Pin Definition of SPI Interfaces Pin Name Pin No.

  • Page 56: Adc Interface

    Can be multiplexed into SPI7_MISO 3.16. ADC Interface SC262R series module supports one Analog-to-Digital Converter (ADC) interface. The ADC interface supports resolution of up to 15 bits. The pin definition is shown below. Table 18: Pin Definition of ADC Interface Pin Name Pin No.

  • Page 57: Lcm Interface

    3.18. LCM Interface SC262R series module provides one LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1440 × 720 @ 60 fps). The pin definition of the LCM interface is shown below.
  • Page 58 Smart Module Series DSI_LN0_P LCD MIPI data 0 (+) DSI_LN1_N LCD MIPI data 1 (-) DSI_LN1_P LCD MIPI data 1 (+) DSI_LN2_N LCD MIPI data 2 (-) DSI_LN2_P LCD MIPI data 2 (+) DSI_LN3_N LCD MIPI data 3 (-) DSI_LN3_P LCD MIPI data 3 (+) SC262R_Series_Hardware_Design 57 / 115...
  • Page 59 Smart Module Series A reference circuit for the LCM interface is shown below. 1 μF 1.8 V VBAT LDO 6_1V8 LEDA LCM _ LED+ LCM _LED- LEDK LPTE LCD_TE RESET LCD_RST LCD_ID GPIO_61 NC (SDA-TP) LDO17_2V85 NC (SCL-TP) NC (RST-TP) 1 μF 4.7 μF 100 nF...

  • Page 60: Touch Panel Interface

    Figure 21: Reference Design for External Backlight Driving Circuit 3.19. Touch Panel Interface SC262R series module provides one I2C interface for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definitions of TP interface pins are illustrated below.

  • Page 61: Camera Interfaces

    Figure 22: Reference Circuit Design for TP Interface 3.20. Camera Interfaces Based on MIPI_CSI standard, SC262R series module supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 13 MP. The video and photo quality is determined by various factors such as the camera sensor, camera lens quality, etc.
  • Page 62 Smart Module Series CSI1_LN3_N MIPI CSI1 lane 3 data (-) CSI1_LN3_P MIPI CSI1 lane 3 data (+) CSI1_LN2_N MIPI CSI1 lane 2 data (-) CSI1_LN2_P MIPI CSI1 lane 2 data (+) CSI0_CLK_N MIPI CSI0 clock (-) CSI0_CLK_P MIPI CSI0 clock (+) CSI0_LN0_N MIPI CSI0 lane 0 data (-) CSI0_LN0_P...
  • Page 63 Smart Module Series DCAM_I2C_SDA I2C data of depth camera Externally pull them up to 1.8 V. DCAM_I2C_SCL I2C clock of depth camera SC262R_Series_Hardware_Design 62 / 115...
  • Page 64 Smart Module Series The following is a reference circuit design for 3-camera applications. 1 μF AF_VDD VBAT GPIO LDO17_2V85 1 μF AVDD VBAT GPIO DVDD DOVDD CAM2_ RST LDO6_1V8 CAM2_PWDN CAM2_MCLK DCAM_I2C_SDA DCAM_I2C_SCL CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N CSI0_CLK_P 1 μF...

  • Page 65: Design Considerations

    Smart Module Series 3.20.1. Design Considerations ⚫ Special attention should be paid to the pin definition of LCM/camera connectors. Make sure the module and the connectors are correctly connected. ⚫ MIPI are high speed signal lines, supporting maximum data rate of up to 2.1 Gbps. The differential impedance should be controlled to 100 Ω.
  • Page 66 Smart Module Series CSI1_LN0_N 18.05 0.05 CSI1_LN0_P 18.10 CSI1_LN1_N 18.15 0.05 CSI1_LN1_P 18.20 CSI1_LN3_N 18.10 0.10 CSI1_LN3_P 18.20 CSI1_LN2_N 18.05 0.05 CSI1_LN2_P 18.10 CSI0_CLK_N 22.60 -0.05 CSI0_CLK_P 22.55 CSI0_LN0_N 22.55 -0.05 CSI0_LN0_P 22.50 CSI0_LN1_N 20.25 0.05 CSI0_LN1_P 20.30 CSI0_LN2_N 20.50 0.00 CSI0_LN2_P 20.50...

  • Page 67: Sensor Interfaces

    Smart Module Series 3.21. Sensor Interfaces SC262R series module supports communication with sensors via I2C interfaces, and it supports ALS/PS sensor, compass, accelerometer sensor, gyroscopic sensor, etc. Table 24: Pin Definition of Sensor Interfaces Pin Name Pin No. Description Comment Dedicated for external sensors.

  • Page 68: Reference Circuit Design For Microphone Interfaces

    Smart Module Series MIC_BIAS2 Bias voltage output for microphone 2 = 1.6–2.85 V MIC3_P Microphone input for channel 2 (+) MIC_BIAS1 Bias voltage output for microphone 1 = 1.6–2.85 V EAR_P Earpiece output (+) EAR_N Earpiece output (-) SPK_P Speaker output (+) SPK_N Speaker output (-) HPH_R...

  • Page 69: Reference Circuit Design For Earpiece Interface

    Smart Module Series 100 nF MIC_BIAS1 MIC_ GND 33 pF MIC3_P MEMS MIC Module 33 pF Figure 25: Reference Circuit Design for MEMS Microphone Interface 3.22.2. Reference Circuit Design for Earpiece Interface 33 pF EAR_P 33 pF EAR_N 33 pF Module Figure 26: Reference Circuit Design for Earpiece Interface 3.22.3.

  • Page 70: Reference Circuit Design For Loudspeaker Interface

    Smart Module Series 3.22.4. Reference Circuit Design for Loudspeaker Interface SPK_P EARP SPK_N 33 pF 33 pF Module Figure 28: Reference Circuit Design for Loudspeaker Interface 3.22.5. Design Considerations for Audio Interfaces It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise.
  • Page 71 Smart Module Series such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. LDO5_1V8 USB_BOOT Module Figure 29: Reference Circuit Design for USB_BOOT Control Interface SC262R_Series_Hardware_Design 70 / 115...

  • Page 72: Wi-Fi And Bluetooth

    PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions. 4.1. Wi-Fi SC262R series module supports 2.4 GHz and 5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 433 Mbps. The features are as below: ⚫...
  • Page 73 Smart Module Series 802.11n HT20 MCS7 13 dBm ± 2.5 dB 802.11n HT40 MCS0 14 dBm ± 2.5 dB 802.11n HT40 MCS7 13 dBm ± 2.5 dB 802.11a 6 Mbps 15 dBm ± 2.5 dB 802.11a 54 Mbps 13 dBm ± 2.5 dB 802.11n HT20 MCS0 14 dBm ±...

  • Page 74: Bluetooth

    IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth SC262R series module supports Bluetooth 4.2 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK, π/4-DQPSK modulation modes. ⚫ Maximally supports up to 7 wireless connections.

  • Page 75: Bluetooth Performance

    ⚫ Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC262R series module. Table 29: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types...

  • Page 76: Gnss

    Smart Module Series GNSS SC262R series module integrates a IZat™ GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo and BDS. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode.

  • Page 77: Reference Design

    Smart Module Series successfully within 3 minutes after executing cold start command. SC262R-WF does not support GNSS. 5.2. Reference Design Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below: ⚫...

  • Page 78: Antenna Interfaces

    Smart Module Series Antenna Interfaces SC262R series module provides four antenna interfaces for the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna respectively. The impedance of the antenna ports should be controlled to 50 Ω. Appropriate antenna type and design should be used with matched antenna parameters according to specific application.
  • Page 79 Smart Module Series DCS1800 1805–1880 1710–1785 PCS1900 1930–1990 1850–1910 WCDMA B1 2110–2170 1920–1980 WCDMA B2 1930–1990 1850–1910 WCDMA B4 2110–2155 1710–1755 WCDMA B5 869–894 824–849 WCDMA B8 925–960 880–915 LTE-FDD B1 2110–2170 1920–1980 LTE-FDD B2 1930–1990 1850–1910 LTE-FDD B3 1805–1880 1710–1785 LTE-FDD B4 2110–2155...

  • Page 80: Reference Design For Main And Rx-Diversity Antenna Interfaces

    Smart Module Series LTE-FDD B2 1930–1990 1850–1910 LTE-FDD B4 2110–2155 1710–1755 LTE-FDD B5 869–894 824–849 LTE-FDD B7 2620–2690 2500–2570 LTE-FDD B12 729–746 699–716 LTE-FDD B13 746–756 777–787 LTE-FDD B14 758–768 788–798 LTE-FDD B17 734–746 704–716 LTE-FDD B25 1930–1995 1850–1915 LTE-FDD B26 859–894 814–849 LTE-FDD B66...

  • Page 81: Wi-Fi And Bluetooth Antenna Interface

    Smart Module Series Main antenna ANT_MAIN antenna ANT_DRX Module Figure 30: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi and Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface.

  • Page 82: Gnss Antenna Interface & Frequency Bands

    Smart Module Series A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 Ω. Wi-Fi/ B luetooth antenna ANT_WIFI/BT Module Figure 31: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3.

  • Page 83: Passive Antenna Reference Design

    Smart Module Series 6.3.1. Passive Antenna Reference Design GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Passive Antenna ANT_GNSS Module Figure 32: Reference Circuit Design for GNSS Passive Antenna NOTE When the passive antenna is placed far away from the module (that is, the antenna trace is long) and the external loss is more than 2 dB, it is recommended to add an external LNA circuit for better GNSS...

  • Page 84: Rf Routing Guidelines

    Smart Module Series Figure 33: Reference Circuit Design for GNSS Active Antenna NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.4.
  • Page 85 Smart Module Series Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: SC262R_Series_Hardware_Design 84 / 115...

  • Page 86: Antenna Installation

    Smart Module Series ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. ⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.

  • Page 87: Rf Connector Recommendation

    Smart Module Series Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) For passive antenna usage: Passive Antenna Gain: > 0 dBi GNSS For active antenna usage: Passive Antenna Gain: > 0 dBi Active Antenna Gain: > -2 dBi Active Antenna Noise Figure: <...
  • Page 88 Smart Module Series U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 40: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com.

  • Page 89: Electrical Characteristics And Reliability

    Smart Module Series Electrical Characteristics and Reliability 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 39: Absolute Maximum Ratings Parameter Min. Max.

  • Page 90: Operating And Storage Temperatures

    Smart Module Series Peak supply Maximum power control level current (during VBAT at EGSM900 transmission slot) USB_VBUS USB power supply 4.35 Power supply VRTC voltage of the 3.25 backup battery 7.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 41: Operating and Storage Temperatures Parameter Min.
  • Page 91 Smart Module Series supply current Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 LTE-FDD Sleep (USB disconnected) @ DRX = 8 supply current Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 LTE-TDD Sleep (USB disconnected) @ DRX = 8...
  • Page 92 Smart Module Series GSM850 (1UL/4DL) @ PCL 5 278.8 GSM850 (2UL/3DL) @ PCL 5 414.2 GSM850 (3UL/2DL) @ PCL 5 495.3 GSM850 (4UL/1DL) @ PCL 5 598.1 EGSM900 (1UL/4DL) @ PCL 5 262.4 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 469.3 EGSM900 (4UL/1DL) @ PCL 5 GPRS data transfer...
  • Page 93 Smart Module Series DCS1800 (2UL/3DL) @ PCL 2 304.5 DCS1800 (3UL/2DL) @ PCL 2 393.4 DCS1800 (4UL/1DL) @ PCL 2 495.1 PCS1900 (1UL/4DL) @ PCL 2 184.7 PCS1900 (2UL/3DL) @ PCL 2 292.2 PCS1900 (3UL/2DL) @ PCL 2 393.4 PCS1900 (4UL/1DL) @ PCL 2 496.2 B1 (HSDPA) @ max.
  • Page 94 Smart Module Series LTE-FDD B28 @ max. power 764.5 LTE-TDD B38 @ max. power 448.4 LTE-TDD B40 @ max. power 432.7 LTE-TDD B41 @ max. power 444.2 Table 43: SC262R-NA Power Consumption Description Conditions Typ. Unit μA OFF state Power down Sleep (USB disconnected) @ DRX = 6 3.698 WCDMA...

  • Page 95: Tx Power

    LTE-FDD B71 @ max. power 688.1 LTE-TDD B41 @ max. power 469.1 7.5. Tx Power The following tables show the RF output power of SC262R series module. Table 44: SC262R-EM RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850 33 dBm ±...
  • Page 96 Smart Module Series WCDMA B2 24 dBm +1/-3 dB < -49 dBm WCDMA B4 24 dBm +1/-3 dB < -49 dBm WCDMA B5 24 dBm +1/-3 dB < -49 dBm WCDMA B8 24 dBm +1/-3 dB < -49 dBm LTE-FDD B1 23 dBm ±...

  • Page 97: Rx Sensitivity

    In GPRS 4-slot Tx mode, the maximum output power is reduced by 3 dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 7.6. Rx Sensitivity The following table shows the RF receiving sensitivity of SC262R series module. Table 46: SC262R-EM RF Receiving Sensitivity Receiving Sensitivity (Typ.)
  • Page 98 Smart Module Series WCDMA B1 -109.5 -111 -106.7 dBm WCDMA B2 -110 109.5 -104.7 dBm WCDMA B4 -110 -109.5 -106.7 dBm WCDMA B5 -111.5 -111 -104.7 dBm WCDMA B8 -111 -111.5 -103.7 dBm LTE-FDD B1 (10 MHz) -98.2 -99.5 -100.5 -96.3 dBm LTE-FDD B2 (10 MHz) -98.2...

  • Page 99: Esd Protection

    ESD protection components to the ESD sensitive interfaces and points in the product design. The following table shows the electrostatic discharge characteristics of SC262R series module. Table 48: ESD Characteristics (Temperature: 25 º C, Humidity: 45 %)

  • Page 100: Mechanical Information

    Smart Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 8.1. Mechanical Dimensions Pin 1 Side view Top view Figure 41: Top and Side Dimensions SC262R_Series_Hardware_Design 99 / 115...
  • Page 101 Smart Module Series Figure 42: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC262R_Series_Hardware_Design 100 / 115...

  • Page 102: Recommended Footprint

    Smart Module Series 8.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. All RESERVED pins should be kept open and MUST NOT be connected to ground. SC262R_Series_Hardware_Design 101 / 115...

  • Page 103: Top And Bottom Views

    Figure 44: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC262R_Series_Hardware_Design 102 / 115...

  • Page 104: Storage, Manufacturing And Packaging

    Smart Module Series Storage, Manufacturing and Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 105: Manufacturing And Soldering

    Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.

  • Page 106: Packaging Specification

    PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4].

  • Page 107: Carrier Tape

    Smart Module Series 9.3.1. Carrier Tape Dimension details are as follow: Figure 46: Carrier Tape Dimension Drawing Table 50: Carrier Tape Dimension Table (Unit: mm) 41.2 41.2 34.2 1.75 9.3.2. Plastic Reel Figure 47: Plastic Reel Dimension Drawing SC262R_Series_Hardware_Design 106 / 115...

  • Page 108: Packaging Process

    Smart Module Series Table 51: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 72.5 9.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.

  • Page 109: Appendix References

    Smart Module Series Appendix References Table 52: Related Documents Document Name [1] Quectel_Smart_EVB_G2_User_Guide [2] Quectel_SC262R_Series_Pin_Description_and_GPIO_Configuration [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note [5] Quectel_SC262R_Series_Reference_Design Table 53: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter ADSP Audio Digital Signal Processor Ambient Light Sensor Adaptive Multi-rate Access Point Advanced RISC Machine Baseband...
  • Page 110 Smart Module Series CDMA Code Division Multiple Access Circular Error Probable CMOS Complementary Metal-Oxide-Semiconductor Customer-Premise Equipment Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier Digital Cellular System Downlink DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Reference Phase Shift Keying Discontinuous Reception Display Serial Interface Digital Signal Processor...
  • Page 111 Smart Module Series ETSI European Telecommunications Standards Institute Evaluation Board EV-DO/EVDO Evolution-Data Optimized EVRC Enhanced Variable Rate Codec Frequency Division Duplex Front End Module Frame per Second Full Rate GFSK Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) GMSK Gaussian Minimum Shift Keying GNSS...
  • Page 112 Smart Module Series HSUPA High Speed Uplink Packet Access High Throughput Integrated Circuit IEEE Institute of Electrical and Electronics Engineers Input/Output Inter-Integrated Circuit IMT-2000 International Mobile Telecommunications for the year 2000 Maximum Output Load Current Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy...
  • Page 113 Smart Module Series Multi Purpose Pin Moisture Sensitivity Levels N.W. Net Weight Near Field Communication Negative Temperature Coefficient Over-the-Air Upgrade On-The-Go One Time Programable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Personal Communication Service Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Unit...
  • Page 114 Smart Module Series RoHS Restriction of Hazardous Substances Real Time Clock Request to Send Surface Acoustic Wave Synchronous Connection Oriented Secure Digital SIMO Single Input Multiple Output Surface Mounting Device Short Message Service Surface Mount Technology Serial Peripheral Interface Station Time-Division Duplex Touch Panel TTFF...
  • Page 115 Smart Module Series Voltage Input Minimum High-level Input Voltage Maximum Low-level Input Voltage Voltage Output Maximum Output Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage WAPI WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network Crystal Oscillator...
  • Page 116 Smart Module Series Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above).
  • Page 117 Smart Module Series 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, mê me si le brouillage est susceptible d’en compromettre le fonctionnement." Déclaration sur l'exposition aux rayonnements RF L'autre utilisé pour l'é metteur doit être installé pour fournir une distance de sé paration d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé...

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