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Table 54: Recommended Thermal Profile Parameters
Factor
Soak Zone
Ramp-to-soak slope
Soak time (between A and B: 150 ° C and 200 ° C)
Reflow Zone
217–235 ° C ramp-up slope
Reflow time (D: over 217° C)
Max temperature
235–217 ° C cool-down slope
Reflow Cycle
Max reflow cycle
NOTE
1.
The above profile parameter requirements are for the measured temperature of the solder joints.
Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2.
Due to the large-size form factor, to avoid excessive temperature change, which may cause
excessive thermal deformation of the metal shielding frame and cover, it is recommended to reduce
the ramp-up and cool-down slopes in the liquid phase of the solder paste. If possible, please choose
a reflow oven with more than 10 temperature zones during production so that there are more
temperature zones to set up to meet the optimal temperature curve.
3.
If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
4.
Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
5.
Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [5].
SG368Z_Series_Hardware_Design
Smart Module Series
Recommended Value
0–2 ° C/s
70–120 s
0–1 ° C/s
40–65 s
235–246 ° C
-1–0 ° C/s
1
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