Quectel SG368Z Series Hardware Design page 11

Smart Module Series
Figure 42: Top & Bottom Views of the Module ....................................................................................... 101
Figure 43: Recommended Reflow Soldering Thermal Profile ................................................................ 103
Figure 44: Carrier Tape Dimension Drawing .......................................................................................... 105
Figure 45: Plastic Reel Dimension Drawing .......................................................................................... 106
Figure 46: Mounting Direction ............................................................................................................... 106
Figure 47: Packaging Process............................................................................................................... 107
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