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QB-V850MINIL, QB-V850MINI Emulator
4.3.5
Mounting target connector
Mount the target connector on the target system in the following order.
Apply cream solder to the foot pattern for mounting the IC on the target system.
（1）
The target connector has a cylindrical projection in the center of the underside (Figure 4-4). Apply a
（2）
two-component hardening type epoxy adhesive agent (a type that hardens in 15 to 30 minutes) sparingly to the
underside of the projection to temporarily secure the connector at the specified location on the target system.
Make sure that the position of pin 1 of the connector (where the corner is cut) matches the position of pin 1 on the
target board.
Mount the target connector under the following conditions.
（3）
a. To mount the target connector by reflow: 245°C within 20 seconds (heating)
b. To mount the target connector by manual soldering: 320°C within 5 seconds (per pin)
Caution The flux splashing that takes place while the connector is being mounted often results in defective conduction.
Be sure to cover the upper part of the connector with aluminum foil. Avoid flux cleaning since the connector
has a structure in which flux solvent is likely to remain.
R20UT0221EJ0400 Rev.4.00
2013.08.30
Figure 4-4. Target Connector Projection Diagram
4. Debugging with In-Circuit method
Page 65 of 86
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