Specifications; Core System; Expansion Busses - ADLINK Technology Express-KL2 User Manual

2. Specifications

2.1.

Core System

CPU
Cache
Memory
Chipset
BIOS
2.2.

Expansion Busses

PCI Express
Other
Specifications
7th Generation Intel® Core™ and Xeon® E3-15xx v6 processors
(formerly "Kaby Lake H")
•
Intel® Xeon® E3-1505M v6 3.0GHz (4.0GHz Turbo), 45W (35W cTDP) (4C/GT2)
•
Intel® Xeon® E3-1505L v5 2.2GHz (3.0GHz Turbo), 25W (4C/GT2)
•
Intel® Core™ i7-7820EQ 3.0GHz (3.7GHz Turbo), 45W (35W cTDP) (4C/GT2)
•
Intel® Core™ i5-7440EQ 2.9GHz (3.6GHz Turbo), 45W (35W cTDP) (4C/GT2)
•
Intel® Core™ i5-7442EQ 2.1GHz (2.9GHz Turbo), 25W (4C/GT2)
•
Intel® Core™ i3-7100E 2.9GHz, 35W (4C/GT2)
•
Intel® Core™ i3-7102E 2.1GHz, 25W (4C/GT2)
Supporting: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64
Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel®
AES-NI, PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel®
Secure Key, Intel® TSXNI
Note: Availability of features may vary between processor SKUs.
8MB for Xeon®/Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3
Dual channel non-ECC/ECC 2133/2400 MHz DDR4 memory up to 32GB in dual stacked
SODIMM socket
Mobile Intel® QM175, HM175 and CM238 Chipset (HM175 does not support Intel® AMT)
•
Core™ i7/i5 with QM175 Chipset (non-ECC memory support)
•
Core™ i3 with HM175 Chipset (non-ECC memory support)
•
Xeon® with CM238 Chipset (ECC and non-ECC memory support)
•
Core™ i3 with CM238 Chipset (ECC and non-ECC memory support, by project basis)
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 11 support
(AMT not supported by HM175)
•
PCI Express x16 Gen3( or 2 x8, or 1 x8 and 2 x4)
•
6 PCI Express x1 (AB): Lanes 0/1/2/3/4/5
•
PCI: 32-bit PCI bus, rev 2.3 (via PCIe-to-PCI chip)
•
LPC bus
•
SMBus (system)
• 2
I C (user)
Express-KL2
3