Specifications; Core System - ADLINK Technology COM-HPC-sIDH User Manual

COM-HPC-sIDH User's Guide

2. Specifications

2.1. Core System

CPU
Intel® Xeon® D-2700 Processor (formerly "Ice Lake-D HCC")
• Intel® Xeon® D-2796TE,
• Intel® Xeon® D-2775TE,
• Intel® Xeon® D-2752TER,
• Intel® Xeon® D-2733NT,
• Intel® Xeon® D-2712T,
Note: Other non-IOTG SKU not listed may be supported by project basis. Please contact our ADLINK local representative.
Memory
Up to 256GB (4x 64GB) DDR4 RDIMM in four DIMM sockets (up to 512 GB by 4x 128GB configuration at LRDIMM, TBC)
Up to 2933 MT/s for D-2796TE/D-2775TE, 2667 MT/s for D-2752TER/D-2733NT/D-2712T
1 DIMM per channel architecture for maximum performance
Embedded BIOS
AMI Aptio V UEFI with CMOS backup in 64 (or 32, TBC) MB SPI BIOS, dual BIOS by build option
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2.0/3.1GHz, 30MB, 20C/40T, 118W (100G Ethernet bandwidth) (eTemp)
2.0/3.1GHz, 25MB, 16C/32T, 100W (100G Ethernet bandwidth) (eTemp)
1.8/2.8GHz, 20MB, 12C/24T, 77W
2.1/3.2GHz, 15MB, 8C/16T, 80W
1.9/3.0GHz, 15MB, 4C/8T, 65W
Copyright © 2023 ADLINK Technology, Inc.
(50G Ethernet bandwidth) (eTemp)
(50G Ethernet bandwidth) (Intel QAT)
(50G Ethernet bandwidth)
PICMG COM-HPC R1.1