Material List; Handling The Sample (Sim Ejector) - NTT docomo MONO MO01J Instruction Manual

Material list

■ MO-01J main unit
Part
Exterior case (ring)
Exterior case (side face)
Power key/Volume key
Manner mode switch
docomo nano UIM card/
microSD card slot cover
docomo nano UIM card/
microSD card tray
Strap hole
Transparent plate (Display,
back side)
Flash/Light panel
Hem of microUSB jack
microUSB jack (metal part) Copper alloy + SUS
Hem of the stereo
earphone jack
Stereo earphone jack
(metal part)
Surface
Material
treatment
PA resin + 50% GF UV coating
PC resin Coating
Aluminum alloy +
Anodizing
PC resin
POM None
PC resin + TPU Coating
Stainless steel Partial insulating
powder metallurgy coating
PC resin None
Hardened glass None
PMMA None
PA9T None
Gold plating,
nickel plating
PPA resin None
Gold plating,
Copper alloy + SUS
nickel plating
■ SIM ejector
Part
SIM ejector

Handling the sample (SIM ejector)

The tip of SIM ejector is sharp. Do not use pointing
to yourself or others.
Doing so may cause injury or loss of sight by hitting yourself or
Don't
others.
14
Surface
Material
treatment
SUS301 None
WARNING
Contents/Precautions