EMC VNX Series Hardware Information Manual page 127

Inter Connect Module (ICM)
Power Supply Module
E
D
C
B
A
0 1 2
Cooling Module
Figure 109 4U, 60 (2.5- or 3.5-inch) DAE disk drive layout and notation (top-down interior view)
Note: The labels for the banks, slots, and LCCA shown in
in the 4U, 60 (2.5- or 3.5-inch) DAE.
Fan control module (cooling module)
Each 4U, 60 (2.5- or 3.5-inch) DAE includes three fan control modules (cooling modules)
located on the front of the DAE. The fan control module includes a fan, fuse, and
microcontroller with an I
The fan control module augments the cooling capacity of each 4U, 60 (2.5- or 3.5-inch)
DAE. It plugs directly into the DAE baseboard from the top of the DAE. Inside the fan
control module, sensors measure the external ambient temperatures to ensure even
cooling throughout the DAE.
Rear of 4U DAE
Power Supply Module
3 4 5 LCCA 6 7 8
Cooling Module Cooling Module
Front of 4U DAE
2
C interface inside a rugged enclosure.
EMC VNX8000 Hardware Information Guide
Disk-array enclosures
Inter Connect Module (ICM)
Disk drive
LCC B
9 10 11
LCC A
VNX-000650
Figure 109 are the physical labels
127