Geometric Envelope For 1U Thermal Mechanical Design; Thermal Interface Material; Koz 3-D Model (Top) In 1U Server - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

8.4 Geometric Envelope for 1U Thermal Mechanical
Design
Figure 8-4.

KOZ 3-D Model (Top) in 1U Server

1.6mm Maximum
Component Height
(2 places)
8.5

Thermal Interface Material

A thermal interface material (TIM) provides conductivity between the IHS and heatsink.
The collaboration thermal solution uses Honeywell PCM45F, which pad size is
35x35 mm.
TIM should be verified to be within its recommended shelf life before use. Surfaces
should be free of foreign materials prior to application of TIM.
64
2.5mm Maximum
Component Height
(6 places)
1U Collaboration Thermal Solution
9.5mm Maximum
Component Height
(5 places)
1.2mm Maximum
Component Height
(1 place)
§
2.07mm Maximum
Component Height
(1 place)