Storage Conditions Specifications; Reference Design Thermal Interface Material (Tim); Storage Condition Ratings; Tim Specification - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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6.1.4

Storage Conditions Specifications

Environmental storage condition limits define the temperature and relative humidity
limits to which the device is exposed while being stored in a moisture barrier bag. the
specified storage conditions are for component level prior to board installation.
Table 6-4
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. At conditions outside sustained
limits, but within absolute maximum and minimum ratings, quality, and reliability may
be affected.
Table 6-4.

Storage Condition Ratings

Symbol
Time
sustained storage
Time
short term storage
T
absolute storage
T
sustained storage
T
short term storage
RH
sustained storage
6.1.5

Reference Design Thermal Interface Material (TIM)

Applying thermal interface material between the processor IHS and the heatsink base
will improve the heat transfer between the IHS and the heatsink. Honeywell* PCM45F
material is selected for use with the Intel reference heatsink design.
The recommended size ensures adequate coverage at the interface between the
processor IHS and heatsink pedestal.
Table 6-5.

TIM Specification

Parameter
TIM Size
PCM45F Activation Load
Refer to the TIM manufacturer's guidelines for specifications and handling instructions.
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
48
specifies absolute maximum and minimum storage temperature limits which
A prolonged or extended period of time; typically
associated with sustained storage conditions.
Unopened bag, includes 6 months storage time by
customer.
A short period of time (in shipping media).
The minimum/maximum device storage temperature
beyond which damage (latent or otherwise) may
occur when subjected to for any length of time.
The minimum/maximum device storage temperature
for a sustained period of time.
The ambient storage temperature (in shipping media)
for a short period of time.
The maximum device storage relative humidity for a
sustained period of time.
Value
47 x 70 x 0.25
340
Thermal Specifications and Design Guidelines
Parameter
Unit
mm Dimensions apply to Honeywell* PCM45F p/n: H38442
N Load required to meet min. TIM pressure (15 psi)
Min. Max. Unit
0 30 months
0 72 hours
-25 125 °C
-5 40 °C
-20 85 °C
60% @ 24 °C
Notes
Order Number: 334785-002