Memory Summary - HP HPE iLO 5 User Manual

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Single Board Mirroring—The system can be configured for mirrored advanced memory
protection in a single memory board.
Advanced ECC—The system can be configured for Advanced ECC.
Mirroring—The system can be configured for mirrored AMP.
On-line Spare—The system can be configured for online spare AMP.
LockStep—The system can be configured for LockStep AMP.
Online Spare (Rank Sparing)—The system can be configured for Online Spare Rank AMP.
Online Spare (Channel Sparing)—The system can be configured for Online Spare Channel AMP.
Intersocket Mirroring—The system can be configured for mirrored intersocket AMP between the
memory of two processors or boards.
Intrasocket Mirroring—The system can be configured for mirrored intrasocket AMP between the
memory of a single processor or board.
A3DC—The system can be configured for A3DC AMP.
None—The system cannot be configured for AMP.

Memory Summary

The Memory Summary section shows a summary of the memory that was installed and operational at
POST.
Location
The slot or processor on which the memory board, cartridge, or riser is installed. Possible values
follow:
System Board—There is no separate memory board slot. All DIMMs are installed on the
motherboard.
Board <Number>—There is a memory board slot available. All DIMMs are installed on the
memory board.
Processor <Number>—The processor on which the memory DIMMs are installed.
Riser <Number>—The riser on which the memory DIMMs are installed.
Number of Sockets
The number of present memory module sockets.
Total Memory
The capacity of the memory, including memory recognized by the operating system and memory used
for spare, mirrored, or XOR configurations.
Speed
The memory module speed.
Operating Voltage
The voltage at which the memory operates.
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Memory Summary

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