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8.2
Thermal Data for ZWT Package
The following table shows the thermal resistance characteristics for the PBGA–ZWT mechanical package.
Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
1
RΘ
Junction-to-case
JC
2
RΘ
Junction-to-board
JB
3
RΘ
Junction-to-free air
JA
4
5
RΘ
Junction-to-moving air
JMA
6
7
8
9
10
Psi
Junction-to-package top
JT
11
12
13
14
15
Psi
Junction-to-board
JB
16
17
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) m/s = meters per second
8.3
Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2009–2017, Texas Instruments Incorporated
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TMS320C6748
SPRS590G – JUNE 2009 – REVISED JANUARY 2017
(1)
°C/W
7.3
12.4
23.7
21.0
20.1
19.3
18.4
0.2
0.3
0.3
0.4
0.5
12.3
12.2
12.1
12.0
11.9
Mechanical Packaging and Orderable Information
TMS320C6748
(2)
AIR FLOW (m/s)
N/A
N /A
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
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