CC3200MOD
SWRS166 – DECEMBER 2014
Pin Internal Pullup and Pulldown (25°C)
PARAMETER
I
Pullup current, V
= 2.4
OH
OH
(VDD = 3.0 V)
I
Pulldown current, V
OL
OL
(VDD = 3.0 V)
(1) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk of
interference to WLAN radio and mitigates any potential degradation of RF sensitivity and performance. The default drive-strength setting
is 6 mA.
4.7
Thermal Resistance Characteristics for MOB Package
NAME
DESCRIPTION
RΘ
Junction-to-case
JC
RΘ
Junction-to-board
JB
RΘ
Junction-to-free air
JA
RΘ
Junction-to-moving air
JMA
Psi
Junction-to-package top
JT
Psi
Junction-to-board
JB
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(3) m/s = meters per second.
4.8
Reset Requirement
PARAMETER
Operation mode level
(1)
Shutdown mode level
Minimum time for nReset low for resetting the
module
Rise/fall times
(1) The nRESET pin must be held below 0.6 V for the module to register a reset.
26
Specifications
(1)
TEST CONDITIONS
= 0.4
SYMBOL
ViH
ViL
Tr/Tf
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MIN
NOM
5
5
°C/W
9.08
10.34
11.60
5.05
9.08
10.19
] value, which is based on a
JC
MIN
TYP
0.65 × VBAT
0
0.6 V
5
20
Copyright © 2014, Texas Instruments Incorporated
www.ti.com
MAX
UNIT
10
µA
µA
(1) (2)
(3)
AIR FLOW (m/s)
0.00
0.00
0.00
< 1.00
0.00
0.00
MAX
UNIT
V
V
ms
µs
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