Toshiba e-STUDIO200L Service Manual page 63

• LDR board:
This is the board on which the laser diode and the ASIC are mounted. The laser is emitted based on
the output image data signal from the ASIC on the LGC board.
• SNS board:
This is the board on which the light sensor for detecting the radiating position of the laser is
mounted.
It outputs the H-sync signal to ASIC on the LGC board.
• LRL board:
This is the board to relay each signal transmitted between the LGC board and laser unit (LDR and
SNS boards).
• ADU board:
This is the board to relay each signal between the ASIC on the LGC board and the electric parts
(motor, sensor, clutch) in the ADU.
• SYS board:
This is the main board taking a leading part in all systems. It consists of the System-CPU, ASIC,
memory (DIMM, SDRAM, Flash ROM, SRAM, NVRAM), RTC (Real Time Clock IC), etc. The Sys-
tem-CPU controls each ASIC to perform the control of the image processing, image memory (page
memory, main memory, HDD), external interface (IEEE-1284, USB, PCI), NIC and FAX.
Based on the input data from the control panel, the System-CPU communicates with the Scanner-
CPU on the SLG board and Engine-CPU on the LGC board, and then issues an operation command
to the scanner and printer engine section.
• LGC board:
This is the board to mainly control the printing function (printer engine). It consists of the Engine-
CPU, ASIC, memory (Flash ROM, SRAM, NVRAM), driver for motor drive, etc. The Engine-CPU
controls each ASIC to drive I/O (for the electrical parts) of each section in the system. It leads to the
operation of the laser unit, developer unit, drum, drawers, bypass unit, ADU, etc. Thus printing is
performed.
• NIC board (e-STUDIO200L/230/230L/280/280S):
This is the interface board to connect this equipment to the LAN environment (10BASE-T,
100BASETX) to communicate with PCs, etc.
• FIL board:
This is the board to cut off the noise of AC power from outside, and supply the driving AC power to
the damp heater for condensation prevention of each section (scanner and drum).
• FUS board:
This is the board to provide the AC electric power for driving to the damp heater for preventing of the
condensation of each section (scanner and drum).
• HVT:
This is the board to generate the DC high voltage from +24V to provide the bias to the section of the
main charger, developer, transfer, and separation.
• PS-ACC:
This is the unit to generate each DC voltage, which is used in the equipment, from external AC elec-
tric power input. And then it is provided to each electrical part.
© 2004 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO200L/202L/203L/230/232/233/280/282/283
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OUTLINE OF THE MACHINE
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