Lenovo ThinkSystem SR630 V3 User Manual page 232

When the server has a Liquid Assisted Cooling Module (LACM) installed, you must apply for a LACM module
handle (LACM heat sink bracket) first if you need to install or remove the system board assembly or
processor. However, while replacing the old LACM with a new one, you do not need to apply for a module
handle (LACM heat sink bracket) as the new LACM package contains it.
CAUTION:
Hazardous moving parts. Keep fingers and other body parts away.
CAUTION:
The heat sinks and processors might be very hot. Turn off the server and wait several minutes to let
the server cool before removing the server cover.
The following illustration shows the layout of the system board assembly which contains the Firmware and
RoT security module, system I/O board, and processor board.
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