Intel Core i7-3970X Manuals

Manuals and User Guides for Intel Core i7-3970X. We have 2 Intel Core i7-3970X manuals available for free PDF download: Design Manual, Datasheet

Intel Core i7-3970X Design Manual (124 pages)

Core i7 Extreme Edition Processor Family for the LGA2011-0 Socket

Brand: Intel | Category: Computer Hardware | Size: 5.23 MB

Table of Contents
3
Revision History
9
1 Introduction

11
- Platform LGA2011-0 Socket Stack with Tall-Heat Pipe Heatsink
  11
  - References
    12
  - Definition of Terms
    12
- Reference Documents
  12
- Terms and Descriptions
  12
2 Package Mechanical Specifications

15
3 LGA2011-0 Socket

19
- Hexagonal Array in LGA2011-0
  19
- LGA2011-0 Socket Attributes
  19
- Contact Wiping Direction
  20
- Schematic of LGA2011-0 Socket with Pick and Place Cover Removed
  20
- LGA2011-0 Socket Contact Numbering (Top View of Socket)
  21
  - Contact/Land Mating Location
    22
  - Board Layout
    22
- Offset between LGA Land Center and Solder Ball Center
  22
  - Attachment to Motherboard
    23
- LGA2011-0 Socket Land Pattern (Top View of Board)
  23
  - Socket Components
    24
    
    Contacts
    24
    
    Pick and Place Cover
    24
    
    Socket Body Housing
    24
    
    Solder Balls
    24
- LGA2011-0 Pick and Place Cover
  25
- Pick and Place Cover
  25
  - Socket Standoffs and Package Seating Plane
    26
  - Durability
    26
  - Markings
    26
  - Component Insertion Forces
    26
  - Socket Size
    26
4 Independent Loading Mechanism (ILM)

27
- Square ILM Design Concept
  28
  - Square ILM Assembly Design Overview
    28
- Square ILM Part Terminology
  28
- Square ILM Assembly
  28
- ILM as Universal Retention Mechanism
  29
- Square ILM Assembly Component Thickness and Material
  29
  - ILM Features
    30
    
    ILM Closing Sequence
    30
- ILM Interlocking Feature
  30
  - ILM Opening Sequence
    31
- ILM Lever Closing Sequence
  31
- Opening ILM
  32
- Opening Sequence for ILM and Loadplate (Cont.)
  32
  - ILM Keying
    33
  - ILM Back Plate Design Overview
    33
- ILM Back Plate
  33
  - ILM Assembly
    34
    
    Manufacturing Assembly Flow
    34
- Assembling Socket, Back Plate and ILM Onto the Motherboard
  34
  - Processor Installation
    35
- Optional Step: Lock down the Hinge Lever
  35
  - ILM Cover
    36
- Pin 1 Markings on the ILM Frame
  36
- Closing ILM and Loadplate
  36
  - Heatsink to ILM Interface
    37
- ILM with Cover
  37
- Heatsink to ILM Interface
  38
5 LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications

39
6 Thermal Management Specifications

43
- Package Thermal Specifications
  43
  - Thermal Specifications
    43
- And DTS Based Thermal Specifications
  44
  - Ttv Tcase
    44
  - Thermal Specification
    44
- Processor Thermal Specifications
  44
- TTV Thermal Profile
  45
- Processor Core Thermal Features
  48
  - Processor Temperature
    48
  - Adaptive Thermal Monitor
    48
    
    Frequency/Svid Control
    49
- Frequency and Voltage Ordering
  49
  - Clock Modulation
    50
  - On-Demand Mode
    50
  - PROCHOT_N Signal
    50
  - THERMTRIP_N Signal
    51
- Platform Environment Control Interface (PECI)
  51
  - Introduction
    51
  - PECI Client Capabilities
    52
- Fan Speed Control with Digital Thermal Sensor
  52
7 PECI Interface

53
- Platform Environment Control Interface (PECI)
  53
- Wrpkgconfig()
  53
- Rdiamsr()
  53
- Summary of Processor-Specific PECI Commands
  53
  - PECI Client Capabilities
    54
    
    Platform Manageability
    54
    
    Processor Interface Tuning and Diagnostics
    54
    
    Thermal Management
    54
  - Processor, and Intel
    54
  - Client Command Suite
    55
    
    Ping()
    55
- Ping() Example
  55
  - Getdib()
    56
- Device Info Field Definition
  56
- Revision Number Definition
  57
- Minor Revision Number Meaning
  57
  - Gettemp()
    58
- Gettemp() Example
  58
  - Rdpkgconfig()
    59
- Gettemp() Response Definition
  59
- Rdpkgconfig() Response Definition
  60
  - Wrpkgconfig()
    61
  - Package Configuration Capabilities
    62
- Wrpkgconfig() Response Definition
  62
- Rdpkgconfig() & Wrpkgconfig() DRAM Thermal Services Summary
  63
- DRAM Thermal Estimation Configuration Data
  64
- Channel & DIMM Index Decoding
  64
- DRAM Rank Temperature Write Data
  65
- DIMM Temperature Read / Write
  65
- Ambient Temperature Reference Data
  66
- DRAM Channel Temperature
  66
- Accumulated DRAM Energy Data
  66
- DRAM Power Info Read Data
  67
- DRAM Power Limit Data
  67
  - Processor Thermal and Power Optimization Capabilities
    68
- DRAM Power Limit Performance Data
  68
  - Processor
    68
- Rdpkgconfig() & Wrpkgconfig() Processor Thermal and Power Optimization Services Summary
  68
- CPUID Data
  71
- Platform ID Data
  71
- Platform ID Encoding
  71
- Uncore Device ID
  72
- Maximum Thread ID
  72
- Processor Microcode Revision
  72
- Package Power SKU Unit Data
  72
- Package Power SKU Data
  73
- Power Control Register Unit Calculations
  73
- Package Temperature Read Data
  74
- Temperature Target Read
  74
  - Per Core Temperature Read
    75
- Thermal Status Word
  75
- Thermal Averaging Constant Write / Read
  75
  - ACPI P-T Notify Read/Write
    76
    
    Accumulated Energy Status Read
    76
    
    Current Limit Read
    76
    
    Thermally Constrained Time Read
    76
- Current Config Limit Read Data
  76
- Accumulated Energy Read Data
  76
- Power Limit Data for
  77
  - CC Power Plane
    77
    
    Socket Performance Indication Read
    78
    
    Socket Power Limit Performance Status Read
    78
    
    Socket Power-Performance Scalability Read
    78
- Socket Power Limit Performance Data
  78
- Socket Power-Performance Scalability Data
  78
- Socket Performance Indication Data
  78
  - Rdiamsr()
    79
- Processor ID Construction Example
  80
- Rdiamsr() Response Definition
  81
- Rdiamsr() Services Summary
  81
  - Rdpciconfig()
    82
- PCI Configuration Address
  82
- Rdpciconfig() Response Definition
  83
  - Rdpciconfiglocal()
    84
- PCI Configuration Address for Local Accesses
  84
- Rdpciconfiglocal() Response Definition
  85
  - Wrpciconfiglocal()
    86
- Wrpciconfiglocal() Response Definition
  87
  - Client Management
    88
    
    Power-Up Sequencing
    88
- Wrpciconfiglocal() Memory Controller Device/Function Support
  88
- PECI Client Response During Power-Up
  88
  - Device Discovery
    89
  - Client Addressing
    89
- SOCKET ID Strapping
  89
  - C-States
    90
  - S-States
    90
- Power Impact of PECI Commands Versus C-States
  90
- Domain ID Definition
  92
  - Client Responses
    93
    
    Abort FCS
    93
    
    Completion Codes
    93
- Multi-Domain Command Code Reference
  93
- Completion Code Pass/Fail Mask
  93
  - Originator Responses
    94
- Device Specific Completion Code (CC) Definition
  94
- Originator Response Guidelines
  94
  - DTS Temperature Data
    95
    
    Format
    95
    
    Interpretation
    95
- Temperature Sensor Data Format
  95
- Temperature Filtering
  95
  - Reserved Values
    96
- Error Codes and Descriptions
  96
8 Thermal Solutions

97
9 Quality and Reliability Requirements

105
A Mechanical Drawings

109
B Socket Mechanical Drawings

113
C Component Suppliers

119
- Suppliers for the LGA2011-0 Socket and ILM
  120
- Suppliers for the LGA-2011-0 Socket and ILM (Continued)
  120
D Package Mechanical Drawings

121

Intel Core i7-3970X Datasheet (120 pages)

Core i7 Extreme Edition Processor Family for the LGA-2011 Socket

Brand: Intel | Category: Computer Hardware | Size: 0.91 MB

Table of Contents
3
Revision History
7
1 Introduction

9
- Processor Feature Details
  10
  - Supported Technologies
    10
- Processor Platform Block Diagram Example
  10
- Interfaces
  11
  - System Memory Support
    11
  - PCI Express
    11
- PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2)
  12
  - Direct Media Interface Gen 2 (DMI2)
    13
  - Platform Environment Control Interface (PECI)
    13
- Power Management Support
  13
  - Processor Package and Core States
    13
  - System States Support
    13
  - Memory Controller
    13
  - PCI Express
    13
- Thermal Management Support
  14
- Package Summary
  14
- Terminology
  14
- Related Documents
  16
- Reference Documents
  16
2 Interfaces

17
- System Memory Interface
  17
  - System Memory Technology Support
    17
  - System Memory Timing Support
    17
- PCI Express* Interface
  17
  - PCI Express* Architecture
    17
    
    Data Link Layer
    18
    
    Transaction Layer
    18
- PCI Express* Layering Diagram
  18
- Packet Flow through the Layers
  18
  - Physical Layer
    19
  - PCI Express* Configuration Mechanism
    19
- DMI2/PCI Express* Interface
  19
  - DMI2 Error Flow
    19
  - DMI2 Link down
    20
- Platform Environment Control Interface (PECI)
  20
3 Technologies

21
- Intel Virtualization Technology (Intel VT)
  21
- And IA-32 Intel
  21
- Virtualization Technology
  21
  - Architecture
    21
    
    VT) for Intel
    21
    
    VT-X) Objectives
    21
    
    And IA-32 Intel
    22
    
    Intel Directed I/O
    22
    
    Virtualization Technology
    22
    
    VT) for
    22
    
    VT-D) Objectives
    22
    
    VT-X) Features
    22
    
    Virtualization Technology
    23
    
    VT) for Directed I/O
    23
    
    VT-D) Features Supported
    23
  - Intel Virtualization Technology Processor Extensions
    23
  - Intel
    23
    
    VT-D) Processor Feature Additions
    23
- Security Technologies
  24
  - Intel ® AES New Instructions (Intel ® AES-NI)
    24
- Intel
  24
  - Execute Disable Bit
    24
    
    HT Technology)
    24
    
    Hyper-Threading Technology
    25
- Intel Turbo Boost Technology
  25
- Enhanced Intel Speedstep Technology
  25
  - Intel ® Turbo Boost Operating Frequency
    25
- Intel Advanced Vector Extensions (Intel AVX)
  26
4 Power Management

27
- Advanced Configuration and Power Interface (ACPI) States Supported
  27
  - System States
    27
  - Processor Package and Core States
    27
- Package C-State Support
  28
- Core C-State Support
  28
  - Integrated Memory Controller States
    29
  - DMI2 / PCI Express* Link States
    29
- DMI2/PCI Express* Link States
  29
- System Memory Power States
  29
  - G, S, and C State Combinations
    30
- Processor Core / Package Power Management
  30
  - Enhanced Intel ® Speedstep ® Technology
    30
  - Low-Power Idle States
    31
- Idle Power Management Breakdown of the Processor Cores
  31
- Thread and Core C-State Entry and Exit
  31
  - Requesting Low-Power Idle States
    32
  - Core C-States
    32
- P_Lvlx to MWAIT Conversion
  32
  - Core C0 State
    33
  - Core C1/C1E State
    33
  - Core C3 State
    33
  - Core C6 State
    33
  - Core C7 State
    33
  - C-State Auto-Demotion
    33
  - Package C-States
    34
    
    Package C0
    35
    
    Package C1/C1E
    35
- Package C-State Entry and Exit
  35
- Coordination of Core Power States at the Package Level
  35
  - Package C2 State
    36
  - Package C3 State
    36
  - Package C6 State
    36
  - Package C-State Power Specifications
    37
- System Memory Power Management
  37
  - CKE Power-Down
    37
  - Self Refresh
    38
    
    DLL and PLL Shutdown
    38
    
    Self Refresh Entry
    38
    
    Self Refresh Exit
    38
  - DRAM I/O Power Management
    38
- DMI2 / PCI Express* Power Management
  38
5 Thermal Management Specifications

39
6 Signal Descriptions

41
7 Electrical Specifications

49
8 Processor Land Listing

71
- Land Name
  72
- Land Number
  95
9 Package Mechanical Specifications

119

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More Intel Manuals

Intel Core i7-3970X Manuals

Intel Core i7-3970X Design Manual (124 pages)

Table of Contents

1 Introduction

2 Package Mechanical Specifications

3 LGA2011-0 Socket

4 Independent Loading Mechanism (ILM)

5 LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications

6 Thermal Management Specifications

7 PECI Interface

8 Thermal Solutions

9 Quality and Reliability Requirements

A Mechanical Drawings

B Socket Mechanical Drawings

C Component Suppliers

D Package Mechanical Drawings

Intel Core i7-3970X Datasheet (120 pages)

Table of Contents

1 Introduction

2 Interfaces

3 Technologies

4 Power Management

5 Thermal Management Specifications

6 Signal Descriptions

7 Electrical Specifications

8 Processor Land Listing

9 Package Mechanical Specifications

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