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1.1
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.
Reference Documents
Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1
Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2
Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Specification Update
Entry-level Electronics Bay Specification
European Blue Angel Recycling Standards
1.2
Definition of Terms
Table 1-2.
Terms and Descriptions (Sheet 1 of 2)
Term
Bypass
DTS
MSR
FSC
IHS
Square ILM
LGA2011-0 socket
PECI
CA
CS
SA
T
CASE
T
_
CASE
MAX
TCC
12
Document
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
The processor provides a variety of model specific registers that are used to control and
report on processor performance. Virtually all MSRs handle system related functions and
are not accessible to an application program.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Independent Loading Mechanism provides the force needed to seat the 2011-LGA
package onto the socket contacts and has 80 × 80 mm heatsink mounting hole pattern.
The Customer Reference Board will use this layout. The enabled Thermal solutions are
only compatible with this ILM.
The processor mates with the system board through this surface mount, 2011-contact
socket for the platform.
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. Heat source should always be specified for
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Package Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
ssiforum.oaktree.com/
Description
CASE
measurements.
CASE
– T
) / Total Package Power.
S
LA
Thermal/Mechanical Specifications and Design Guide
Introduction
Location
326196
326197
326198
Available at http://
http://www.blauer-
engel.de
– T
) / Total
LA
– T
) / Total
S
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