Ilm As Universal Retention Mechanism; Square Ilm Assembly Component Thickness And Material - Intel BX80619I73820 Design Manual

Independent Loading Mechanism (ILM)
The hinge lever and active lever are designed to place equal force on both ends of the
ILM load plate. The frame provides the hinge locations for the levers. The hinge lever
connects the load plate to the frame. When closed, the load plate applies four point
loads onto the IHS at the "finger" features shown in
contributes to minimizing package and socket warpage as compared to two point
loading. The reaction force from closing the load plate is transmitted to the frame and
through the captive fasteners to the back plate. Some of the load is passed through the
socket body to the board inducing a slight compression on the solder joints.
Table 4-1.

Square ILM Assembly Component Thickness and Material

ILM Frame
ILM Loadplate
ILM Backplate
Figure 4-3
the ILM to the back plate. This attachment method requires four holes in the
motherboard for the ILM and no additional holes for the thermal solution. Orientation of
the ILM is controlled with a key on the socket body. Orientation of the thermal solution
is an option with a key to the ILM.
Note: Some customer reference boards (CRB) have four additional outer holes in the board.
These holes are legacy and are not required for the current ILM reference design.
Figure 4-3.

ILM as Universal Retention Mechanism

Thermal/Mechanical Specifications and Design Guide
Component
1.5
1.5
2.2
shows the attachment points of the thermal solution to the ILM frame and
Figure
Thickness (mm)
301 Stainless Steel
301 Stainless Steel
S50C Low Carbon Steel
4-2. Four point loading
Material
29