Geometric Envelope For The Intel® Reference Atx Thermal Mechanical Design; Atx Koz 3-D Model Primary (Top) Side; Reference Heat Sink Clearance Above The Motherboard - Intel BX80619I73820 Design Manual

Thermal Solutions
8.3 Geometric Envelope for the Intel
Thermal Mechanical Design
Figure 8-3
reference ATX thermal solution. A fully dimensioned drawing of the keepout information
is available at
drawings is available as well as a 3-D IGES model of the board level keep out zone is
available. Contact your field sales representative for these documents.
Figure 8-3.

ATX KOZ 3-D Model Primary (Top) Side

Note: All Maximum Component Heights are post reflow / assembly
Table 8-2.

Reference Heat Sink Clearance above the Motherboard

Tall Heat Pipe Heat Sink (T-HPHS)
Radial Fin Copper Core (DRA-A)
The chassis obstruction height allows for appropriate fan inlet airflow to ensure fan
performance, and therefore overall cooling solution performance.
Thermal/Mechanical Specifications and Design Guide
shows a 3-D representation of the board component keep out for the
Figure A-1 and Figure A-2
Max Heat Sink Height above
Heat Sink
130mm [5.51 inches]
71.12mm [2.8 inches]
®
Reference ATX
in Appendix A. A PDF version of these
the motherboard
N/A side inlet for airflow
81.28mm [3.2 inches]
Chassis Obstruction Height
above motherboard
99