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2.1.7
Processor Materials
Table 2-3
Table 2-3.
Processor Materials
Integrated Heat Spreader (IHS)
Substrate
Substrate Lands
2.1.8
Processor Markings
Figure 2-3
identification of the processor.
Figure 2-3. Processor Top-Side Markings
18
lists some of the package components and associated materials.
Component
shows the topside markings on the processor. This diagram is to aid in the
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Lot #
S/N
- 0
Package Mechanical Specifications
Material
Nickel Plated Copper
Halogen Free, Fiber Reinforced Resin
Gold Plated Copper
Legend:
Sample (QDF):
GRP1LINE1:
i{M}{C}YY
GRP1LINE2:
INTEL CONFIDENTIAL
GRP1LINE3:
QDF ES SPEED
GRP1LINE4:
XXXXX
GRP1LINE5:
{FPO} {e4}
Legend:
Production (SSPEC):
GRP1LINE1:
i{M}{C}YY
GRP1LINE2:
SUB-BRAND PROC#
GRP1LINE3:
SSPEC SPEED
GRP1LINE4:
XXXXX
GRP1LINE5:
{FPO} {e4}
Note: XXXXX = Country of Origin
§ §
Thermal/Mechanical Specifications and Design Guide
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