Power Consumption - Kontron CP308 User Manual

3u compactpci processor board based on the intel core 2 duo processor with the mobile intel gs45 express chipset
Table of Contents

Advertisement

Power Considerations
5.2

Power Consumption

The goal of this description is to provide a method to calculate the power consumption for the
CP308 baseboard and for additional configurations. The processor dissipates the majority of
the thermal power.
The power consumption tables below list the voltage and power specifications for the CP308
board and the CP308 accessories. The values were measured using an 8-slot passive Com-
pactPCI backplane with two power supplies: one for the CP308 (5V and 3.3V power supply),
and the other for the hard disk and the CompactPCI system fans. The measurements were per-
formed under EFI shell, Linux® and Windows® XP and at a temperature of 25°C. The mea-
sured values varied, because the power consumption was dependent on processor activity.
Note ...
The power consumption values indicated in the tables below can vary depend-
ing on the ambient temperature or the system performance. This can result in
deviations of the power consumption values of up to 10%.
The power consumption was measured using the following processors:
• Intel® Core™2 Duo processor SU9300 (ULV), 1.2 GHz, 800 MHz FSB, 3 MB L2 cache
• Intel® Core™2 Duo processor SL9400 (LV), 1.86 GHz, 1066 MHz FSB, 6 MB L2 cache
• Intel® Core™2 Duo processor SP9300 (SV), 2.26 GHz, 1066 MHz FSB, 6 MB L2 cache
with the following firmware and under the following testing conditions:
• CP308 in EFI shell mode
• CP308 with Linux®/Windows® XP, IDLE Mode
With these operating systems both processor cores were in IDLE state.
• CP308 with Linux®/Windows® XP, Memory Test
These values represent the maximum power dissipation achieved through the use of a
specific memory test tool to heat up the memory.
• CP308 Thermal Design Power (TDP) at 75%
These values represent the "typical" maximum power dissipation reached under OS-con-
trolled applications.
• CP308 Thermal Design Power (TDP) at 100%
These values represent the maximum power dissipation achieved through the use of
specific tools to heat up the processor cores. 100% TDP is unlikely to be reached in real
applications.
The following tables indicate the power consumption of the CP308 populated with 1 GB DDR3
SODIMM module in each DDR3 SODIMM socket. For measurements made with the Linux®
and Windows® XP operating systems, the VGA resolution was 1024 x 768 pixels.
Page 5 - 6
CP308
ID 1027-4487, Rev. 3.0

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents