Mechanical Specifications; Processor Package Assembly Sketch - Intel BX80569Q9550 - Core 2 Quad 2.83 GHz Processor Datasheet

Mechanical Specifications

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Mechanical Specifications
The Intel
package that interfaces with the motherboard via an LGA1248 socket. The package top
side consists of lands that interface with a LGA connector for direct power delivery to
the core, cache and system interface. The package also consists of an integrated
heatsink spreader (IHS), which is attached to the package substrate and die and serves
as the mating surface for the processor component thermal solutions, such as a
heatsink. The bottom side of the package has 1248 lands, a 38 x 38 mm pad array
which interfaces with the LGA1248 socket.
package components and how they are assembled together.
The package components shown in
1. Integrated Heat Spreader (IHS).
2. Processor die.
3. Internal test pads for power delivery.
4. LGA lands for I/O.
5. Decoupling and server management components.
6. LGA lands for power delivery.
Figure 4-1.

Processor Package Assembly Sketch

Note: This drawing is not to scale and is for reference only. Processor power delivery and thermal solutions,
and the socket are not shown.
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Intel Itanium Processor 9300 Series and 9500 Series Datasheet
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Itanium Processor 9300 Series and 9500 Series are packaged in a FC-LGA
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Figure 4-1 shows a sketch of the processor
Figure 4-1 include the following:
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