Socket Size; Actuation And Insertion Requirements; Package Translation; Insertion/Removal/Actuation Forces - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Figure 3-9.

Wetting Angle and Wetting Height

3.4

Socket Size

The socket size will meet the dimensions as shown in
of the package into the socket without interference. This information should be used in
conjunction with the reference main board keep-out drawings provided in
ensure compatibility with the reference thermal mechanical components.
3.5

Actuation and Insertion Requirements

3.5.1

Package Translation

The socket should be built so that the post-actuated seating plane of the package is
flush with the seating plane of the socket. Movement will be along the axis normal to
the seating plane.
3.5.2

Insertion/Removal/Actuation Forces

Any actuation will meet or exceed SEMI S8-95 Safety Guidelines for
Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment,
example Table R2-7 (Maximum Grip Forces), available at http://www.semi.org/.
The socket is designed so that no force is required to insert the package into the
socket, and no tool is required to insert or remove the package
.
Table 3-3.

PnP Cover Ergonomics Requirements

Direction
Vertical
In and
Out of
Plane
In-Plane
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
30
Description
°
Closed position at 260 C 0.75 lbf
Closed position at room
temperature.
Shock
Removal
PnP Cap
Appendix
Min. Max.
- While holding at reflow temp.
3 lbf 22 lbf Pull off force for cap removal.
0.8 lbf - During shipping.
- 1.7 lbf Will meet Ergonomic requirements.
- - +/- 3.5 mils placement accuracy; in-plane
slack.
Socket Mechanical Design
D, allowing full insertion
Appendix F to
Comments
Order Number: 334785-002