Table of Contents
Advertisement
MSPM0G3507-Q1, MSPM0G3506-Q1, MSPM0G3505-Q1
SLASF88 – OCTOBER 2023
10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Getting Started and Next Steps
For more information on the MSP low-power microcontrollers and the tools and libraries that are available to help
with development, visit the Texas Instruments
10.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP
MCU devices and support tools. . Each MSP MCU commercial family member has one of two prefixes: MSP
or X. These prefixes represent evolutionary stages of product development from engineering prototypes (X)
through fully qualified production devices (MSP).
X – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
X devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes." MSP devices have been characterized
fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X) have a greater failure rate than the standard production devices. TI
recommends that these devices not be used in any production system because their expected end-use failure
rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature
range, package type, and distribution format.
name.
Processor Family
MCU Platform
Product Family
Device Subfamily
Flash Memory
Temperature Range
Package Type
76
Submit Document Feedback
Arm Cortex-M0+ MCUs
Figure 10-1
M0
G
350
MCU Platform
Product Family
Device Subfamily
Figure 10-1. Device Nomenclature
Table 10-1. Device Nomenclature
MSP = Mixed-signal processor
X= Experimental silicon
M0 = Arm based 32-bit M0+
G = 80-MHz frequency
350 = CAN-FD, 2x ADC, 2x OPA, 3x COMP
5 = 32KB
6 = 64KB
7 = 128KB
Q = –40°C to 125°C, AEC-Q100 qualified
See the
Device Comparison
Product Folder Links:
MSPM0G3507-Q1 MSPM0G3506-Q1 MSPM0G3505-Q1
page.
provides a legend for reading the complete device
7
Q
RHB
R Q1
Qualified for Automotive
Distribution Format
Package Type
Temperature range
Flash Memory
section and
https://www.ti.com/packaging
www.ti.com
Copyright © 2023 Texas Instruments Incorporated
Advertisement
Table of Contents
Need help?
Do you have a question about the MSPM0G350 Series and is the answer not in the manual?