Table of Contents
Advertisement
www.ti.com
5 Device Comparison
The following table summarizes the features of each device that is described in this data sheet.
FLASH /SRAM
(1) (4)
DEVICE NAME
(KB)
MSPM0G3505xPM
32 / 16
MSPM0G3506xPM
64 / 32
MSPM0G3507xPM
128 / 32
MSPM0G3505xPT
32 / 16
MSPM0G3506xPT
64 / 32
MSPM0G3507xPT
128 / 32
MSPM0G3505xRGZ
32 / 16
MSPM0G3506xRGZ
64 / 32
MSPM0G3507xRGZ
128 / 32
MSPM0G3505xRHB
32 / 16
MSPM0G3506xRHB
64 / 32
MSPM0G3507xRHB
128 / 32
MSPM0G3505xRGE
32 / 16
MSPM0G3506xRGE
64 / 32
MSPM0G3507xRGE
128 / 32
MSPM0G3505xDGS28
32 / 16
MSPM0G3506xDGS28
64 / 32
MSPM0G3507xDGS28
128 / 32
(1)
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in
(2)
Device Qualifications:
•
Q = –40°C to 125°C , AEC-Q100 qualified
(3)
The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see
(4)
For more information about the device name, see
(5)
24, 32 and 48-pin VQFN packages are available with wettable flanks
Copyright © 2023 Texas Instruments Incorporated
Table 5-1. Device Comparison
MATH
ADC /
(2)
QUAL
COMP
ACCEL
CHAN
Q
Y
2 / 17
3
Q
Y
2 / 16
3
Q
Y
2 / 16
3
Q
Y
2 / 11
3
Q
Y
2 / 9
3
Q
Y
2 / 11
3
Section 10.2
Product Folder Links:
MSPM0G3507-Q1 MSPM0G3506-Q1 MSPM0G3505-Q1
MSPM0G3507-Q1, MSPM0G3506-Q1, MSPM0G3505-Q1
DAC
OPA
GPAMP
UART/I2C/SPI
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
SLASF88 – OCTOBER 2023
CAN
TIMA
TIMG
GPIO
[PACKAGE SIZE]
1
2
5
60
[12 mm × 12 mm]
1
2
5
44
1
2
5
44
[7 mm × 7 mm]
1
2
5
28
[5 mm × 5 mm]
1
2
5
20
[4 mm × 4 mm]
1
2
5
24
[7.1 mm × 3 mm]
Section
11, or see the
TI
website.
Section
11.
Submit Document Feedback
PACKAGE
(3)
64 LQFP
48 LQFP
[9 mm × 9 mm]
48 VQFN
(5)
32 VQFN
(5)
24 VQFN
(5)
28 VSSOP
5
Advertisement
Table of Contents
Need help?
Do you have a question about the MSPM0G350 Series and is the answer not in the manual?