Fluke TIP900 Operating Instructions Manual page 64

Operation
: Auto temperature scaling activation. Herewith the lower and upper temperature to color
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assignment is performed by automatic calculation. It's a normalize temperature function, like the
Gaussian distribution.
: GREEN or RED
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detection algorithm.
: Direction of gypsum wallboard movement in relation to the fix scanner position. See also under
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no. 7 the indicator marks for L = leading edge, T = trailing edge. The lower green status bar in
the column grows towards the green direction arrow, to indicate a running process with moving
gypsum wallboards.
: Cursor position information of a pointing device (mouse, touch area), which is shifted over the
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board map domain. The current temperature value at the current cursor position is displayed.
The cursor position counts in X- and Y- axis from the upper left board map domain corner. The
black area is the blanked out domain of the background and gets 0°C or 32°F assigned to. This
is done by the board border recognition process in the TIP900 software.
: In dependence of the board movement in direction to the scanner, it has to be marked, where
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board leading edge = L and the board trailing edge = T is. Both symbols indicate that.
: Indication of the maximum measured surface temperature of the scanned wallboard set.
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: Display of "Dryer Chain Side" and "Operator Side" as orientation support.
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: Display of the current processed dryer deck number, where the wallboards are assigned to.
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Note: In the board map display domain is a hidden "Inspect Boards" activation function available,
which will be described in chapter 5.2.1.5. If you move or wipe the position cursor over the board
map area, you discover the changing X-Y cursor positions and the assigned temperature values
in the upper left corner. In case there is any point of interest on the displayed board map, like a
dark (low temperature) or bright (high temperature) zone, which is worth for a more detailed
analysis, you can select the point of interest by touch selection or mouse click. Immediately after
the selection is done, the actual board map snapshot is taken and will be displayed in the
"Inspect Board Map" sub-window of the "Process Screens" domain, which is described in
chapter 5.2.1.3. While the production process continues and the "Board Map" displays shows
the currently scanned thermal images passing by, the "Inspect Board Map" sub-window stays
with the last map snapshot for a detailed analysis.
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outline to indicate, that
Rev. E1 Feb 2016
good or bad boards were detected by the software defect
TIP900