Quectel BG95 A-GL Series Hardware Design page 12

LPWA Module Series
Figure 42: Recommended Footprint (Top View, Unit: mm) .......................................................................109
Figure 43: Top & Bottom Views of BG95xA-GL .........................................................................................110
Figure 44: Recommended Reflow Soldering Thermal Profile ...................................................................112
Figure 45: Carrier Tape Dimension Drawing ............................................................................................. 114
Figure 46: Plastic Reel Dimension Drawing .............................................................................................. 114
Figure 47: Packaging Process ...................................................................................................................115
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