Recommended Footprint - Quectel BG95 A-GL Series Hardware Design

8.2. Recommended Footprint

1.00
1.00
Pin1
0.25
0.70
1.10
Figure 42: Recommended Footprint (Top View, Unit: mm)
.
NOTE
1. Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
2. All reserved pins must be kept open.
3. For stencil design requirements of the module, see document [6].
BG95xA-GL_Hardware_Design
19.90±0.20
9.95
9.15
7.45
1.95
1.10
2.50
1.70
1.10
1.70
0.15
1.70
1.70
0.85
1.00
1.10
1.00
1.10 2.50
0.25
4.25
5.95
62x0.7
62x1.10
9.95
9.15
7.15
0.25
1.10
0.55
1.70
0.85
0.85
2.55
1.10
4.25
5.95
40x1.0
40x1.0
LPWA Module Series
0.25
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