Quectel BG95 A-GL Series Hardware Design page 92

LPWA Module Series
19.90±0.20
1.00
1.10 0.55 1.95 1.10
0.25
1.00
Pin1
5.10
0.25
1.00
0.85 1.70
1.90
1.10
1.00
1.70
0.70
1.00
1.70
0.50
0.25
0.55
0.25
1.10
40x1.0
62x0.7
62x1.10
40x1.0
Figure 41: Module Bottom Dimensions (Bottom View, Unit: mm)
NOTE
The package warpage level of the module conforms to the JEITA ED-7306 standard.
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