Power Consumption; Heat Dissipation; Heat Sink Type - Enclustra Mercury SA1 SoC Module User Manual

Pin Name Module Connector Pins
A-26, 29, 50, 86
VCC_3V3
B-55, 79, 115, 127, 152, 155
VCC_2V5 A-53, 62, 65, 89
VCC_1V8 B-52, 76, 108, 128
Table 13: Voltage Supply Outputs
Warning!
Do not connect any power supply to the voltage supply outputs nor short circuit them to GND, as this
may damage the Mercury SA1 SoC module.
2.11.5

Power Consumption

Please note that the power consumption of any SoC device strongly depends on the application (on the
configured bitstream and I/O activity).
To estimate the power consumption of your design, please use the Intel PowerPlay Early Power Estimators
(EPE) and Power Analyzer available on the Intel website.
2.11.6

Heat Dissipation

High performance devices like the Intel Cyclone V SoC need cooling in most applications; always make sure
the SoC is adequately cooled.
For Mercury modules an Enclustra heat sink kit is available for purchase along with the product. It represents
an optimal solution to cool the Mercury SA1 SoC module - the heat sink body is low profile and usually covers
the whole module surface. The kit comes with a gap pad for the SoC device, a fan and required mounting
material to attach the heat sink to the module PCB and baseboard PCB. With additional user configured gap
pads, it is possible to cool other components on board as well.
Alternatively, if the Enclustra heat sink does not match the application requirements, a third-party heat sink
body (ATS) and an additional gap pad (t-Global) may be used. Please note that the Enclustra heat sink kit
already contains all necessary items for cooling the module (heat sink body, gap pad, fan, mounting mate-
rial).
Table 14 lists the heat sink and thermal pad part numbers that are compatible with the Mercury SA1 SoC
module. Details on the Mercury heatsink kit can be found in the Mercury Heatsink Application Note [17].
Product Name Package Name
Mercury SA1 672-pin UBGA [24]
Table 14: Heat Sink Type
4
The maximum available output current depends on your design. See sections 2.11.1 and 2.11.5 for details.
D-0000-402-002
Voltage Maximum
Current
3 A (and max
3.3 V 5%
0.3 A per pin)
2.5 V 5% 0.5 A
1.8 V 5% 0.5 A
Enclustra
Heat Sink
ACC-HS3-Set
25 / 49
Comment
4
Always active
Controlled by PWR_EN
Controlled by PWR_EN
ATS t-Global
Heat Sink Thermal Pad
ATS-52230G-C1-R0 TG-A6200-25-25-1
Version 06, 16.02.2021