Lenovo ThinkSystem SR630 V3 User Manual page 76

Fan type Performance
Max. DIMM Qty. 2 32
Notes:
1. TDP, short for Thermal Design Power. When processor 6434/6434H-195W installed, use the T-shape
heat sink and performance fans.
2. When a 256 GB 3DS RDIMM is installed, the ambient temperature must be limited to 30°C or lower and
performance fans are required.
Server models with front and rear drive bays
This section provides thermal information for server models with middle or rear drive bays.
Configuration
Max. Ambient Temp. (at
sea level)
CPU TDP 2 (watts)
Heat sink
Air baffle
Fan type
Max. DIMM Qty. 3
Notes:
1. In the configuration of 10 x 2.5'' AnyBay or 10 x 2.5'' NVMe, rear U.2 or U.3 is supported, but rear SAS/
SATA is not supported.
2. TDP, short for Thermal Design Power. When processor 6434/6434H-195W installed, use the T-shape
heat sink and performance fans.
3. The 256 GB 3DS RDIMMs are not supported.
Server models with GPU(s)
This section provides thermal information for server models with GPUs.
GPUs supported:
• NVIDIA ® A2
• NVIDIA ® L4
ThinkSystem SR630 V3 User Guide
66
Performance
32
• 4 x 2.5'' SAS/SATA
• 4 x 2.5'' NVMe
• 4 x 3.5'' SAS/SATA
• 4 x 3.5'' AnyBay
• 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe
• 6 x SAS/SATA + 4 x AnyBay
• 8 x 2.5'' SAS/SATA
• 8 x 2.5'' AnyBay drives with one processor
• 8 x 2.5'' U.2 drives with one processor
• 10 x 2.5'' SAS/SATA
• 10 x 2.5'' AnyBay
• 10 x 2.5'' NVMe
• Rear 2 x 2.5'' SAS/SATA
• Rear 2 x 2.5'' U.2 1
• Rear 2 x 2.5'' U.3 1
35°C with rear SAS/SATA drives
30°C with rear U.2/U.3 drives
TDP ≤ 165
Standard
√
Performance
32
Performance
32
1
165 < TDP < 205
Standard
√
Performance
32
Performance
32
TDP = 205
T-shape
x
Performance
32